Principal Engineer Unit Process Development Die Attach - Melaka
Packaging & Advanced Integration
Originally posted 15 September 2026 by the employer — open 4 days.
About the role
This role involves performing process development activities for die attach in the Research & Development team.
What you'll do
- Perform process parameter scouting, optimization, verification, and process freeze.
- Manage technical handover, knowledge transfer, and support prototype and development sample builds.
- Prepare, maintain, and provide input for process-related documentation including Process Specifications, PFMEA, DFMEA, OJTI, T32 (P), PDR, Process of Record, Assembly Design Rules, Process Roadmaps, Failure Catalogues, Control Plans, and Maintenance Checklists.
- Collaborate with suppliers on continuous improvement initiatives and perform verification and qualification of new tooling, equipment, and materials.
- Participate in task forces and problem-solving activities using statistical and analytical tools, including SPC, APC, DOE, 8D, and FMEA.
- Identify, develop, and improve process technologies and capabilities to meet business and product requirements.
What you'll need
- Master's or Bachelor's Degree in Engineering or a related discipline.
- Minimum 10 years of working experience in the semiconductor manufacturing industry.
- Hands-on knowledge of assembly processes and relevant industry practices.
- Knowledge of analytical equipment and statistical data analysis, including Design of Experiments (DOE).
- Proficient in Microsoft Office applications.
Market context
This role has been open 4 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
53 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 18 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 315 | 9328 · 108 employers |
| Median days open | 39 d | 53 d (−14 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 100 d
- Micron Technology · 36 open roles · median 27 d
- Renesas Electronics · 21 open roles · median 19 d
- Infineon Technologies (this employer) · 18 open roles · median 39 d
- Intel Corporation · 13 open roles · median 74 d
- Lumilens · 13 open roles · median 43 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.