$160,400 - $220,550 USD yearly
Originally posted 18 September 2026 by the employer.
The role focuses on identifying technologies and design concepts to address tin debris in Laser-Produced Plasma EUV systems.
About the role
This role is for a Principal Engineer, Thermal & Fluids Systems responsible for providing technical leadership in addressing undesired tin debris in EUV systems using thermal and flow schemes. The position involves identifying technologies and design concepts related to process chamber design for Laser-Produced Plasma EUV.
What you'll do
- Lead technical solutions and hardware for tin mitigation.
- Identify and drive execution of concepts to address thermal, flow, and mechanical performance gaps.
- Lead architecture and prototyping definition, including practical tradeoffs.
- Develop and maintain sub-module specification document trees and coordinate key reviews.
- Define Test Protocols, analyze test data, and make recommendations for design and operational changes.
- Assess technology and project risks, and define risk mitigation strategies.
What you'll need
- Bachelor’s degree in Engineering (Mechanical, Chemical or Materials) or related technical discipline with emphasis in thermodynamics, materials, and fluid dynamics.
- 10+ years of relevant experience.
- 6+ years (MS) / 3+ years (Ph.D.) of experience in a technical leadership role, with direct experience in theoretical or practical thermodynamics and fluid dynamics.
- Experience with interpretation and application of CFD results to guide hardware and process optimization.
- Familiarity with heat transfer analysis and methodologies.
- Experience with thermal and gas flow elements of process chamber design.
Nice to have
- MS or PhD.
- Previous role(s) in Technology, Process and/or Engineering Design of Semiconductor processing equipment.
- Project Engineering experience including leading small technical teams.
Skills: EUV, thermal, fluid dynamics, process chamber design, hardware, prototyping
This role has been open 24 days — well below the 73-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Lithography Systems
|
Open roles in category
52
|
Median days open
73 d
|
Median salary
$132k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | ASML | All employers we track in this specialty (52 roles · 12 employers) |
|---|---|---|
| Open roles in this specialty | 29 | 52 |
| Open roles in the wider Process, Fab & Equipment family | 335 | 9854 · 109 employers |
| Median days open | 39 d | 73 d (−34 d vs this employer) |
| Median salary (USD postings) | — | $132k |
Skills observed across this category: EUV, thermal, fluid dynamics, process chamber design, hardware, prototyping
Who's hiring in this category
- ASML (this employer) · 28 open roles · median 37 d
- Applied Materials · 4 open roles · median 102 d
- GlobalFoundries · 4 open roles · median 112 d
- Micron Technology · 4 open roles · median 155 d
- Onto Innovation · 3 open roles · median 82 d
- NXP Semiconductors · 2 open roles · median 110 d
How we counted: 52 open Semiconductor Equipment Engineering (Lithography Systems) roles from 12 employers tracked in the SemiconductorJobs index, counted 13 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.