Principal Design Engineer - Hyderabad, India

Originally posted 6 August 2026 by the employer — open 35 days. Relisted by the employer on 6 August 2026.

Design high-speed interface IPs with a strong emphasis on Die-to-Die (D2D) interconnects based on the UCIe standard.

About the role

This role involves driving the design and delivery of high-speed interface IPs with a focus on Die-to-Die (D2D) interconnects based on the UCIe standard and advanced package technologies.

What you'll do

• Architect, design, and deliver high-speed analog / mixed-signal circuits for Die-to-Die and chiplet-based systems, including UCIe-compliant interfaces.
• Own analog blocks for high-speed interfaces such as clocking, TX/RX front-ends, termination schemes, biasing, and equalization support circuits.
• Drive architecture definition, feasibility analysis, and design trade-offs considering signal integrity, power, noise, and packaging parasitics.
• Perform schematic design, simulation, and optimization across PVT corners using industry-standard EDA tools.
• Work closely with advanced package teams (2.5D / 3D, interposers, organic substrates) to co-optimize circuit and package design.
• Support layout reviews, parasitic extraction analysis, and post-layout sign-off for high-speed performance.

What you'll need

• Bachelor’s or Master’s degree in Electrical / Electronics Engineering or related field.
• 8+ years of hands-on experience in analog / mixed-signal IC design.
• Strong experience with high-speed interface design (e.g., DDR, PCIe, SerDes, Die-to-Die links).
• Solid understanding of UCIe standard concepts, D2D PHY requirements, and chiplet architectures.
• Experience working with advanced packaging technologies and understanding package-induced effects on high-speed signaling.
• Proficiency in schematic-level design, simulation, and debug across PVT corners.
• Strong fundamentals in analog circuit theory, signal integrity, noise analysis, and clocking.

Nice to have

• Direct hands-on experience with UCIe PHY design or integration.
• Exposure to AMS verification flows and mixed-signal simulation environments.
• Experience with post-silicon debug and correlation.
• Knowledge of power integrity, thermal considerations, and package-aware design flows.
• Ability to mentor junior engineers and lead technical discussions.

Skills: high-speed analog, mixed-signal IC design, SerDes, UCIe, chiplet architectures, advanced packaging