Principal Chipset Project Engineer – Thermal/Limits for Personal Computer (PC)
$211,900 - $317,900 USD yearly
Originally posted 3 April 2026 by the employer.
About the role
The Principal Chipset Project Engineer – Thermal/Limits for Personal Computer (PC) leads the thermal and limits strategy across the compute product portfolio through all phases from concept to commercialization. The role oversees thermal behavior and thermally constrained system performance for compute chipsets comprising application processors, PMICs, audio, connectivity, and modems.
What you'll do
- Guide design and architectural choices for chipsets, platforms, and software to maximize thermally constrained performance within product constraints. - Drive methodology and tool development to analyze, model, and predict thermal behavior while assisting thermal, power, and performance tuning. - Define system thermal budgets and establish best practices to tune system limits management feature sets. - Evaluate new thermal solutions and assess the thermal impact of system component selection. - Oversee the resolution of all thermal-related issues across chipsets throughout concept, design, and commercialization. - Interact directly with OEM and ODM customers to provide guidance on thermal targets, solutions, debug, and tuning.
What you'll need
- Bachelor's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field with 8+ years of engineering experience (or Master's with 7+ years, or PhD with 6+ years). - 8+ years of experience in one or more areas of semiconductor product development. - 5+ years in a technical leadership role. - Experience defining system thermal budgets and modeling thermal behavior under fixed product constraints.
Nice to have
- Master's Degree or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or related field. - 10 years of experience in semiconductor product development across system design, architecture, silicon design and validation, or SW development and test. - 8 years of experience in a thermal systems role, with specific PC thermal systems experience. - 4 years of experience working in a large matrixed organization. - 3 years of work experience in a role requiring interaction with executive leadership. - Prior experience in the PC industry.
Skills: thermal budgets, thermal modeling, system limits, product constraints, customer guidance
This role has been open 200 days — well above the 76-day median for Product Engineering roles.
Product Engineering · Power Management
|
Open roles in category
38
|
Median days open
76 d
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Median salary
—
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See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Qualcomm | All employers we track in this specialty (38 roles · 15 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 38 |
| Open roles in the wider Silicon Validation & Test family | 137 | 2235 · 112 employers |
| Median days open | 109 d | 76 d (+33 d vs this employer) |
| Median salary (USD postings) | — | — |
Skills observed across this category: thermal budgets, thermal modeling, system limits, product constraints, customer guidance
Who's hiring in this category
- Infineon Technologies · 5 open roles · median 69 d
- Renesas Electronics · 5 open roles · median 59 d
- Nexperia · 4 open roles · median 101 d
- onsemi · 4 open roles · median 79 d
- Vishay Intertechnology · 4 open roles · median 92 d
- Texas Instruments · 3 open roles · median 31 d
How we counted: 38 open Product Engineering (Power Management) roles from 15 employers tracked in the SemiconductorJobs index, counted 25 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Silicon Validation & Test family row. Figures refresh nightly.