Development Reliability Staff Engineer - Scottsdale, AZ, United States
Originally posted 19 May 2026 by the employer.
Lead reliability engineering and qualification for power semiconductor products across Si, SiC, and GaN technologies.
About the role
This role provides technical leadership in reliability engineering to deliver power semiconductor products across silicon, silicon carbide (SiC), and gallium nitride (GaN) technologies. The focus encompasses chip–package interactions, advanced power packaging, discrete devices, and power modules.
What you'll do
- Define and own NPD reliability and robustness requirements for power semiconductor products while interfacing with Fab, Packaging, Product Engineering, Manufacturing, and Business Units. - Lead reliability assessments for advanced power packaging technologies including sintered die attach, copper clip/ribbon, embedded die, power modules, and double-sided cooling. - Analyze chip–package interaction effects and thermo-mechanical failure mechanisms to propose design, process, or material improvements. - Develop, validate, and calibrate lifetime and acceleration models based on physics of failure and test data.
What you'll need
- MS in Electrical Engineering, Materials Science, or Mechanical Engineering with 3–5 years of relevant experience, or a recent or graduating PhD in the same fields. - Strong understanding of physics of failure, particularly electro-thermo-mechanical mechanisms in semiconductor devices and packages. - Experience with power semiconductor products including Si, SiC, GaN discrete devices and/or power modules. - Proven experience with chip–package interactions, package materials, and assembly processes. - Proficiency with structured problem-solving tools (FMEA, 8D, root cause analysis) and statistical analysis tools (JMP, Minitab).
Nice to have
- Experience extracting data, creating reports, and building dashboards using Power BI, Python, Oracle, and/or SQL. - Knowledge of industry reliability standards such as JEDEC, AEC, IEC, MIL, and AQG324. - Experience working with automotive customers/OEMs.
Skills: robustness, durability, reliability, physics of failure, power semiconductor
This role has been open 158 days — well above the 53-day median for Reliability Engineering roles.
Reliability Engineering · Reliability Engineering
|
Open roles in category
458
|
Median days open
53 d
|
Median salary
$153k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (458 roles · 72 employers) |
|---|---|---|
| Open roles in this specialty | 18 | 458 |
| Open roles in the wider Process, Fab & Equipment family | 258 | 10039 · 106 employers |
| Median days open | 82 d | 53 d (+29 d vs this employer) |
| Median salary (USD postings) | — | $153k |
Skills observed across this category: robustness, durability, reliability, physics of failure, power semiconductor
Who's hiring in this category
- Micron Technology · 78 open roles · median 121 d
- Infineon Technologies · 33 open roles · median 43 d
- Renesas Electronics · 26 open roles · median 29 d
- Applied Materials · 20 open roles · median 48 d
- Analog Devices · 18 open roles · median 64 d
- onsemi (this employer) · 18 open roles · median 82 d
How we counted: 458 open Reliability Engineering (Reliability Engineering) roles from 72 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.