Plasma/Dry Etch Manufacturing Process Engineer (DMOS6) - Dallas, TX, United States
Originally posted 11 September 2026 by the employer.
About the role
This role involves driving continual improvement of manufacturing procedures and processes as a Manufacturing Process Engineer within the DMOS6 300mm wafer Fab.
What you'll do
- Support 24/7 manufacturing operations.
- Develop and implement improved manufacturing methods, procedures, and processes.
- Implement project or improvement plans for efficiency, cost reduction, quality improvement, and new product support.
- Perform lot and equipment dispositions to support continuous production flow and minimize cycle time.
- Identify systematic problems in process or equipment related sources and communicate findings to engineering staff.
- Support manufacturing ramp with execution of equipment/process startup and process experiments (SWRs).
- Participate in data analysis and problem resolution.
What you'll need
- 2 years of experience in the Semiconductor Industry as a Dry/Plasma etch process engineer.
- Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field.
- Strong foundation in statistical process control.
- Strong foundation in engineering change control.
- Strong foundation in process release strategies.
Nice to have
- Demonstrated strong analytical and problem solving skills.
- Strong verbal and written communication skills.
- Ability to work in teams and collaborate effectively with people in different functions.
- Strong time management skills that enable on-time project delivery.
- Demonstrated ability to build strong, influential relationships.
- Ability to take the initiative and drive for result.
Skills: dry etch, plasma etch, manufacturing process, 300mm wafer Fab, statistical process control, process release
This role has been open 40 days — well below the 61-day median for Process Engineering roles.
Process Engineering · Etch Process
|
Open roles in category
75
|
Median days open
61 d
|
Median salary
—
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (75 roles · 20 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 75 |
| Open roles in the wider Process, Fab & Equipment family | 256 | 10093 · 106 employers |
| Median days open | 51 d | 61 d (−10 d vs this employer) |
| Median salary (USD postings) | — | — |
Skills observed across this category: dry etch, plasma etch, manufacturing process, 300mm wafer Fab, statistical process control, process release
Who's hiring in this category
- Micron Technology · 34 open roles · median 85 d
- STMicroelectronics · 8 open roles · median 37 d
- Texas Instruments (this employer) · 4 open roles · median 51 d
- Tower Semiconductor · 4 open roles · median 51 d
- Lam Research · 3 open roles · median 108 d
- Applied Materials · 2 open roles · median 31 d
How we counted: 75 open Process Engineering (Etch Process) roles from 20 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.