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NXP Semiconductors

Physical Design Methodology Lead - Noida, India

NXP Semiconductors Noida, India 6 days ago
Physical Design & EDA

Originally posted 29 September 2026 by the employer.

About the role

This role leads backend design automation for advanced process node SoC and ASIC implementation, focusing on enabling robust and scalable RTL-to-GDS flows.

What you'll do

  • Own, develop, and improve backend RTL-to-GDS implementation flows for advanced process nodes.
  • Drive methodology development across place and route, CTS, timing closure, congestion analysis, and signoff readiness.
  • Partner with design, architecture, DFT, verification, timing, low-power, package, foundry, and signoff teams to meet tapeout requirements.
  • Establish repeatable best practices, reference flows, automation frameworks, and metrics to improve PPA.
  • Work with EDA vendors to evaluate and adopt new technologies in physical implementation and signoff.
  • Debug complex flow, tool, constraint, timing, power, congestion, and physical verification issues.

What you'll need

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical discipline.
  • 15+ years of experience in physical design, backend implementation, CAD, design automation, or flow and methodology development.
  • Strong hands-on expertise with RTL-to-GDS implementation flows, including synthesis, floorplanning, placement, CTS, routing, optimization, extraction, timing closure, ECO, and physical verification.
  • Deep understanding of timing signoff, constraints, STA debug, SDC methodology, multi-corner multi-mode closure, and setup/hold optimization.
  • Experience with power grid design, IR drop, EM analysis, low-power implementation, multi-voltage design, UPF-based flows, and power optimization techniques.
  • Strong scripting and automation skills using Tcl, Python, Perl, or shell scripting.
  • Experience working with EDA platforms from Synopsys, Cadence, Siemens EDA, or equivalent tool ecosystems.
  • Demonstrated ability to influence technical direction and drive cross-team initiatives.

Skills: physical design methodology, RTL-to-GDS implementation, timing closure, power integrity, EDA vendors

Market context

This role has been open 0 days — well below the 64-day median for Physical Design roles.

Physical Design · Physical Design

Open roles in category
627
Median days open
64 d
Median salary
$185k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How NXP Semiconductors compares in Physical Design hiring
Metric NXP Semiconductors All employers we track in this specialty (627 roles · 79 employers)
Open roles in this specialty 24 627
Open roles in the wider Physical Implementation family 46 1420 · 109 employers
Median days open 26 d 64 d (−38 d vs this employer)
Median salary (USD postings) — $185k

Skills observed across this category: physical design methodology, RTL-to-GDS implementation, timing closure, power integrity, EDA vendors

Who's hiring in this category

  • Qualcomm · 114 open roles · median 40 d
  • AMD · 44 open roles · median 28 d
  • Broadcom · 40 open roles · median 78 d
  • NVIDIA · 38 open roles · median 53 d
  • Synopsys · 27 open roles · median 56 d
  • NXP Semiconductors (this employer) · 25 open roles · median 77 d

How we counted: 627 open Physical Design (Physical Design) roles from 79 employers tracked in the SemiconductorJobs index, counted 29 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Physical Implementation family row. Figures refresh nightly.

Apply now
Noida, India
On-site
6 days ago

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