Packaging & Advanced Integration
Applications & FAE
Scale customer engagements for Localized Electrochemical Manufacturing (LEM) technology across advanced packaging architectures.
About the role
The Applications Engineering Manager serves as the primary technical interface between Syenta's advanced manufacturing technology and its global customer base. The role focuses on translating customer requirements into technical project proposals, overseeing technical delivery, and scaling customer engagements in advanced packaging using Localized Electrochemical Manufacturing (LEM) technology.
What you'll do
- Act as the lead technical expert during the pre-sales process and conduct discovery sessions to capture customer requirements, constraints, and pain points.
- Design detailed project proposals, including scope, milestones, technical approach, and feasibility assessments across advanced packaging applications.
- Oversee the full lifecycle of customer projects from kickoff through delivery, ensuring technical milestones and deliverables are met.
- Serve as the final escalation point for complex technical challenges, working cross-functionally with R&D, process, and hardware teams to resolve issues.
- Deliver technical presentations and demos to customer stakeholders, including CTOs and Directors of Engineering.
- Recruit, mentor, and manage a team of applications engineers while establishing best practices for documentation, customer interaction, and project tracking.
What you'll need
- 7+ years of experience in applications engineering, technical sales, or engineering management within semiconductors, advanced packaging, or electronics.
- B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
- Understanding of advanced semiconductor packaging, including 2.5D, 3D integration, FOWLP / FOPLP, hybrid bonding, and bridge architectures.
- Familiarity with chip-last and chip-on-wafer/substrate processes.
- Experience with hardware/software integration, CAD/CAM tools, and system-level troubleshooting.
- Demonstrated experience managing customer-facing technical projects and leading technical teams.
Skills: advanced packaging, technical sales, pre-sales, 2.5D, hybrid bonding
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