Originally posted 22 September 2026 by the employer.
About the role
As a member of the S3 India physical design team, you will help bring to life designs in a leadership capacity, focusing on high-performance SOCs/ASICS for DPU/APU/GPU/Others designs.
What you'll do
- Be the subject matter expert for multiple SOC/ASICs in the RTL2GDSII domain, including physical design implementation, timing closure, and various sign-off activities.
- Provide leadership and mentorship for convergence of complex tiles/partitions/blocks across multiple Subsystems and IPs (e.g., PCIE, DDR, CPUs, GPUs, Gfx, ETH, UCIE).
- Collaborate with cross-functional teams (architecture, design, verification, DFT, product management) to achieve PPA goals.
- Provide strategic direction for SOC/Subsystem and Tile/Partition level execution.
- Drive methodology development and internal forums for adopting latest flows/methodologies and AI technologies.
- Define and track key performance indicators (KPIs) related to RTL2GDSII, reporting progress to leadership.
What you'll need
- 15+ years of industry experience in Physical design (RTL to GDS, STA, Physical verification, timing signoff, tapeout).
- Experience with SOC and Block-level implementation, including Floorplanning, Timing Closure, and Physical Verification.
- Proficiency in Physical Design verification sign-off techniques such as Formal Equivalence, IR&EM, Timing Closure (STA), Physical verification, VSI, Formal Equivalence Check or LEC.
- Expert level understanding of Power, Performance, and Area (PPA) optimization techniques.
- Hands-on experience with Perl/TCL/Shell/Python scripting, and Verilog/VHDL RTL design.
- Ability to drive/manage projects from RTL to GDS, with experience managing 5-10+ tape-outs.
- Proficiency in physical design industry-standard EDA tools like Fusion compiler/ICC2/Primetime/Redhawk/PTPX, low power, and physical verification tools.
Nice to have
- Expert level understanding of EDA tools across Synopsys and Cadence.
- Latest use of AI technologies.
- Good understanding of foundry DRM and collaboration experience with DTCO and FTO.
- B.Tech/M.Tech/MS/Ph.D. in Computer/Electronics/Electrical Engineering.
Skills: RTL2GDSII, Physical Design, Timing closure, PnR, Physical Verification
This role has been open 0 days — well below the 61-day median for Physical Design roles.
Physical Design · Physical Design
|
Open roles in category
633
|
Median days open
61 d
|
Median salary
$185k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | AMD | All employers we track in this specialty (633 roles · 78 employers) |
|---|---|---|
| Open roles in this specialty | 36 | 633 |
| Open roles in the wider Physical Implementation family | 62 | 1414 · 108 employers |
| Median days open | 38 d | 61 d (−23 d vs this employer) |
| Median salary (USD postings) | — | $185k |
Skills observed across this category: RTL2GDSII, Physical Design, Timing closure, PnR, Physical Verification
Who's hiring in this category
- Qualcomm · 122 open roles · median 37 d
- Broadcom · 39 open roles · median 72 d
- NVIDIA · 38 open roles · median 47 d
- AMD (this employer) · 36 open roles · median 38 d
- Synopsys · 27 open roles · median 61 d
- Renesas Electronics · 25 open roles · median 49 d
How we counted: 633 open Physical Design (Physical Design) roles from 78 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Physical Implementation family row. Figures refresh nightly.