Packaging Technology Development Graduate Intern - Arizona, Phoenix, United States
$120,898 - $120,902 USD yearly
Originally posted 14 September 2026 by the employer — open 4 days.
About the role
This role involves supporting the development and implementation of manufacturing processes for specialized modules in semiconductor production.
What you'll do
- Assist in the development and optimization of manufacturing processes for specific modules. - Support equipment troubleshooting, maintenance, and qualification activities. - Collaborate with engineering teams to sustain and improve manufacturing processes and equipment. - Apply process characterization methodologies and Design of Experiments (DOE) principles. - Conduct structured data analysis and experiments to identify process improvement areas. - Participate in hands-on engineering projects and activities in a cleanroom environment.
What you'll need
- Pursuing a PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Polymer Engineering, or a related field. - 3+ months of experience with semiconductor manufacturing equipment and process development methodologies. - 3+ months of experience in data analysis tools such as MATLAB, Python, or JMP.
Skills: manufacturing processes, specialized modules, equipment troubleshooting, process characterization, DOE
This role has been open 4 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
65 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (199 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 170 | 9328 · 108 employers |
| Median days open | 148 d | 65 d (+83 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: manufacturing processes, specialized modules, equipment troubleshooting, process characterization, DOE
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 19 open roles · median 141 d
- Renesas Electronics · 19 open roles · median 23 d
- Intel Corporation (this employer) · 12 open roles · median 147 d
- Monolithic Power Systems · 12 open roles · median 183 d
- onsemi · 7 open roles · median 63 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.