Packaging Process Development Engineer - Arizona, Phoenix, United States
$99,030 - $188,890 USD yearly
Originally posted 7 October 2026 by the employer.
About the role
This role involves developing and optimizing assembly processes and equipment for semiconductor packaging technologies.
What you'll do
- Develop and optimize assembly media and collaterals to meet quality, reliability, cost, yield, productivity, and manufacturability targets.
- Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to refine media and collateral capabilities.
- Design and maintain equipment to evaluate media and collateral performance under simulated field conditions.
- Ensure manufacturability of physical prototypes and oversee manufacturing workflows.
- Define material specifications and collaborate with supplier quality and procurement teams to maintain compliance.
- Leverage understanding of failure mechanisms to establish reliability benchmarks aligned with customer requirements.
What you'll need
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of experience OR a Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field.
- Knowledge of mechanical design software such as SolidWorks or AutoCAD.
- Mechanical drawings and Geometric Dimensioning and Tolerancing (GD&T) principles.
Nice to have
- 2+ years of experience in Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
- Experience in high-precision manufacturing methods, including stamping and CNC machining.
- Experience in semiconductor fabrication processes and packaging technologies.
- Experience in supply chain management in a manufacturing or materials qualification environment.
Skills: assembly processes, design of experiments, statistical process control, material specifications, failure mechanisms
This role has been open 1 day — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
63 d
|
Median salary
$162k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (196 roles · 43 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9729 · 107 employers |
| Median days open | 95 d | 63 d (+32 d vs this employer) |
| Median salary (USD postings) | — | $162k |
Skills observed across this category: assembly processes, design of experiments, statistical process control, material specifications, failure mechanisms
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 44 d
- Renesas Electronics · 23 open roles · median 39 d
- Micron Technology · 20 open roles · median 146 d
- onsemi · 13 open roles · median 23 d
- Monolithic Power Systems · 11 open roles · median 203 d
- Intel Corporation (this employer) · 7 open roles · median 94 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 43 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.