Sr. Manager Packaging Engineering - CA, Santa Clara, United States
Originally posted 9 October 2026 by the employer.
About the role
It involves driving operational excellence and scaling execution using AI/ML-enabled methodologies.
What you'll do
- Lead end-to-end execution of multiple Data Center GPU / MI package design programs.
- Establish and maintain robust execution frameworks, including milestone tracking and risk management.
- Lead, mentor, and grow a high-performing team of package design engineers.
- Collaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergence.
- Engage with OSAT and substrate vendors to drive design feasibility, manufacturability, and yield optimization.
- Define and drive improved design methodologies, workflows, and best practices.
What you'll need
- Experience in semiconductor package design, with strong focus on high-performance or data center products.
- Proven experience leading teams and executing multiple concurrent complex projects.
- Strong understanding of package layout, high-speed design considerations, and multi-die integration.
- B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field.
Nice to have
- Experience with AI/ML applications in engineering workflows (design automation, data analytics, optimization).
- Experience working with OSATs, substrate vendors, and manufacturing partners.
- Hands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalent.
- Experience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration).
Skills: next-generation Data Center GPU, high-performance package designs, multi-die integration, OSAT partners, AI/ML-enabled methodologies
This role has been open 0 days — well below the 42-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
71
|
Median days open
42 d
|
Median salary
$175k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | AMD | All employers we track in this specialty (71 roles · 25 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 71 |
| Median days open | 45 d | 42 d (+3 d vs this employer) |
| Median salary (USD postings) | — | $175k |
Skills observed across this category: next-generation Data Center GPU, high-performance package designs, multi-die integration, OSAT partners, AI/ML-enabled methodologies
Who's hiring in this category
- Micron Technology · 10 open roles · median 160 d
- Marvell Technology · 8 open roles · median 29 d
- AMD (this employer) · 6 open roles · median 45 d
- Broadcom · 4 open roles · median 131 d
- GlobalFoundries · 4 open roles · median 99 d
- Intel Corporation · 4 open roles · median 21 d
How we counted: 71 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 25 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.