Packaging Intern - Greensboro, NC, United States
$31 - $42 USD yearly
Originally posted 28 August 2026 by the employer.
About the role
This internship focuses on packaging engineering within the Global Operations business group.
What you'll do
- Learn about Technology Development projects methodologies.
- Learn about Design Rules and Assembly Process.
- Review Assembly and Marking diagrams for improvement opportunities.
- Support project deployment through material and BOM review.
- Gain hands-on experience in semiconductor assembly processes.
- Assist with documentation and continuous improvement activities.
What you'll need
- BS in Materials Science or Mechanical Engineering.
- Mechanical/Material Engineering skills.
- 3.0 GPA or higher.
Nice to have
- Background with packaging materials (e.g., solder, epoxy, flux, mold compound).
- Background with assembly process (e.g., Wire Bond, Die Attach, Flip Chip).
- Experience using simulation software (e.g., ANSYS, COMSOL, SolidWork Simulation).
- Familiarity with automating simulation tasks using scripting or macros.
Skills: packaging materials, assembly process, wire bond, die attach, flip chip, BOM
This role has been open 29 days — well below the 74-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
203
|
Median days open
74 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (203 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 203 |
| Open roles in the wider Process, Fab & Equipment family | 46 | 9573 · 108 employers |
| Median days open | 28 d | 74 d (−46 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: packaging materials, assembly process, wire bond, die attach, flip chip, BOM
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 40 d
- Renesas Electronics · 23 open roles · median 32 d
- Micron Technology · 17 open roles · median 151 d
- Intel Corporation · 13 open roles · median 157 d
- Monolithic Power Systems · 12 open roles · median 193 d
- onsemi · 11 open roles · median 19 d
How we counted: 203 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 29 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.