Packaging Engineering Intern - Summer - Austin
Originally posted 5 September 2026 by the employer — open 12 days.
About the role
This role involves end-to-end process development and integration for semiconductor packaging processes. Interns will engage in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis.
What you'll do
- Design and iterate on machines and subsystems for semiconductor packaging fabrication, including laser ablation machines, reflow ovens, and automated metal plating facilities.
- Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics.
- Collaborate with cross-functional teams to continuously improve fabrication processes and equipment.
- Perform hands-on package/wafer processing, including 3D printing, metal plating, lithography, and metrology.
What you'll need
- Pursuing a Bachelor's Degree or higher in engineering.
- At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices.
- Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.).
- Hands-on prototyping experience.
Nice to have
- Proven experience in mechatronics or electromechanical system design.
- Familiarity with lasering and 3D printing (stereolithography).
- Experience with reliability testing, soldering, and reflow testing.
- Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.).
This role has been open 11 days — well below the 52-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
52 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Atomic Semi | All employers we track in this specialty (299 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 25 | 9320 · 108 employers |
| Median days open | 11 d | 52 d (−41 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Who's hiring in this category
- KLA Corporation · 50 open roles · median 98 d
- Micron Technology · 32 open roles · median 29 d
- Renesas Electronics · 22 open roles · median 17 d
- Infineon Technologies · 21 open roles · median 37 d
- Intel Corporation · 15 open roles · median 57 d
- Lumilens · 13 open roles · median 41 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 17 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.