Packaging Engineering Intern - Dallas, TX, United States
Originally posted 2 September 2026 by the employer.
About the role
This Packaging Engineering Intern position involves working across various work areas and organizations to help with the design, development, and analysis of semiconductor packaging technologies. The role enables differentiation for analog and embedded processing products through technologies such as Wirebond, Flip Chip, Modules, and SIPs.
What you'll do
- Interface across various work areas and organizations.
- Help with the design, development, and analysis of semiconductor packaging technologies.
- Participate in cross-functional teams to develop internal and external solutions for packaging technologies.
- Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization.
What you'll need
- Currently pursuing a Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering or related.
- Cumulative 3.0/4.0 GPA or higher.
Nice to have
- Semiconductor packaging knowledge (processes, assembly, reliability, materials, characterization, FA).
- Demonstrated analytical and problem-solving skills.
- Strong written and verbal communication skills.
- Ability to work in teams and collaborate effectively with people in different functions.
- Strong time management skills that enable on-time project delivery.
- Ability to build strong, influential relationships.
- Ability to work effectively in a rapidly changing environment.
- Ability to take the initiative and drive for results.
Skills: Semiconductor packaging, assembly, reliability, materials, characterization, FA
This role has been open 20 days — well below the 69-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
69 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (196 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 219 | 9479 · 109 employers |
| Median days open | 69 d | 69 d (same as this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: Semiconductor packaging, assembly, reliability, materials, characterization, FA
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 34 d
- Renesas Electronics · 20 open roles · median 26 d
- Micron Technology · 17 open roles · median 145 d
- Intel Corporation · 12 open roles · median 151 d
- Monolithic Power Systems · 12 open roles · median 187 d
- onsemi · 8 open roles · median 50 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.