Packaging Engineering Intern - Apopka, FL, United States
$31 - $42 USD yearly
Originally posted 2 September 2026 by the employer — open 8 days.
About the role
This Packaging Engineering Internship is in the Global Operations business group.
What you'll do
- Gain knowledge on Back Grinding, Dicing, and DTR Processes.
- Assist with R&D and continuous improvement initiatives.
- Contribute to the advancement of DTR image analysis with a programming initiative.
- Characterize R&D products and processes using solid modeling and laser metrology.
- Perform onsite hands-on learning of semiconductor assembly processes.
- Participate in documentation and continuous improvement activities.
What you'll need
- BS in Mechanical, Chemical, or Electrical Engineering.
- Communication and presentation skills.
- Ability to manage and drive problem resolution.
- Demonstrated strong analytical thinking skills.
- Ability to work autonomously.
Skills: Back Grinding, Dicing, DTR Processes, semiconductor assembly, solid modeling, laser metrology
This role has been open 7 days — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
201
|
Median days open
68 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (201 roles · 45 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 201 |
| Open roles in the wider Process, Fab & Equipment family | 50 | 9211 · 109 employers |
| Median days open | 10 d | 68 d (−58 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Skills observed across this category: Back Grinding, Dicing, DTR Processes, semiconductor assembly, solid modeling, laser metrology
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 22 open roles · median 132 d
- Renesas Electronics · 18 open roles · median 39 d
- Monolithic Power Systems · 12 open roles · median 174 d
- Intel Corporation · 11 open roles · median 139 d
- onsemi · 6 open roles · median 86 d
How we counted: 201 open Packaging Engineering (Packaging) roles from 45 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.