Packaging Engineering Intern - Greensboro, NC, United States
$31 - $42 USD yearly
Originally posted 26 August 2026 by the employer.
About the role
This internship involves learning about Advanced Packaging and Substrate Technology Development projects and improving semiconductor assembly processes.
What you'll do
- Learn about Advanced Packaging and Substrate Technology Development project methodologies.
- Learn about Substrate Design Rules and Manufacturing Processes.
- Review Assembly and Marking diagrams to identify improvement opportunities.
- Plan and execute Design of Experiments to support project deployment.
- Gain hands-on experience with semiconductor assembly processes.
- Perform activities related to documentation and continuous improvement (A3s - Lean).
What you'll need
- BS in Materials Science, Chemical, Mechanical, or Electrical Engineering.
- Background with packaging materials (e.g., solder, epoxy, flux, mold compound).
- Background with assembly process (e.g., Wire Bond, Die Attach, Flip Chip).
- 3.0 GPA or higher.
Skills: Advanced Packaging, Substrate Technology, Design of Experiments, semiconductor assembly processes, Wire Bond, Die Attach, Flip Chip
This role has been open 28 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (297 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 43 | 9489 · 108 employers |
| Median days open | 28 d | 58 d (−30 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: Advanced Packaging, Substrate Technology, Design of Experiments, semiconductor assembly processes, Wire Bond, Die Attach
Who's hiring in this category
- KLA Corporation · 50 open roles · median 108 d
- Micron Technology · 33 open roles · median 32 d
- Infineon Technologies · 18 open roles · median 47 d
- Renesas Electronics · 18 open roles · median 23 d
- onsemi · 15 open roles · median 19 d
- Intel Corporation · 14 open roles · median 76 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 28 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.