Packaging Engineer II, New College Grad- Master's (Santa Clara, CA)
$90,000 - $124,000 USD yearly
Originally posted 14 September 2026 by the employer — open 4 days.
About the role
This role involves developing, implementing, and maintaining packaging designs for product assemblies and parts, focusing on materials, equipment, and methods. You will contribute to cost-saving initiatives and apply engineering change order processes.
What you'll do
- Develop, implement, and maintain packaging designs for product assemblies and parts.
- Generate packaging piece-part and material specifications.
- Research and implement packaging materials, equipment, and methods.
- Perform root cause analysis on packaging failures and recommend corrective action.
- Identify and pursue cost-saving initiatives.
- Release specifications via Engineering Change Order process.
What you'll need
- Master's Degree in Mechanical Engineering, Packaging Engineering, or a related field.
- Good academic standard at university, with a preferred GPA of 3.0 or above on a 4.0 scale.
Skills: packaging designs, material specifications, cost-saving initiatives, root cause analysis, engineering change order
This role has been open 4 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
65 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (199 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 1080 | 9328 · 108 employers |
| Median days open | 48 d | 65 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: packaging designs, material specifications, cost-saving initiatives, root cause analysis, engineering change order
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 19 open roles · median 141 d
- Renesas Electronics · 19 open roles · median 23 d
- Intel Corporation · 12 open roles · median 147 d
- Monolithic Power Systems · 12 open roles · median 183 d
- onsemi · 7 open roles · median 63 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.