Packaging Engineer - Dallas, TX, United States
Originally posted 27 October 2026 by the employer.
Focus on developing substrates, mold compound, and packaging materials for power devices targeting datacenter and automotive applications.
About the role
As a member of the packaging team, you will interact with multiple product groups and functions across the Package Technology Solutions organization. The role focuses on developing and enhancing packaging materials and solutions for power devices targeting datacenter and automotive applications.
What you'll do
- Develop and enhance substrates, mold compound, and other packaging materials for power devices with a focus on datacenter and automotive applications. - Collaborate with product lines, assembly and test (AT) sites, and suppliers to define package requirements and roadmaps for power devices. - Co-design and qualify new power packages and capabilities with various product groups. - Perform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability. - Utilize thermal and mechanical modeling to aid in package technology choice and design tradeoffs. - Coordinate the introduction of new package processes into production at internal/external AT sites and prepare specifications for integrated circuits or semiconductor assemblies.
What you'll need
- Bachelor's degree in Electrical Engineering, Materials Engineering, Mechanical Engineering, or a related engineering field of study. - 5+ years of experience working as an engineer on projects with substantial packaging activities.
Nice to have
- Ability to design packages with an emphasis on power efficiency. - Understanding of inductor design and manufacturing. - Ability to work with assembly sites to ramp new processes. - Understanding of manufacturing impact on quality and best practices to ensure supplier quality.
Skills: packaging, substrates, power devices, mold compound, thermal modeling
This role has been open 0 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
214
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (214 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 214 |
| Open roles in the wider Process, Fab & Equipment family | 253 | 10147 · 107 employers |
| Median days open | 103 d | 58 d (+45 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: packaging, substrates, power devices, mold compound, thermal modeling
Who's hiring in this category
- Renesas Electronics · 30 open roles · median 39 d
- Infineon Technologies · 25 open roles · median 43 d
- Micron Technology · 21 open roles · median 42 d
- onsemi · 17 open roles · median 32 d
- Intel Corporation · 11 open roles · median 111 d
- Monolithic Power Systems · 11 open roles · median 221 d
How we counted: 214 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.