Package Process Development - Sr. Manager, Engineering - Irvine, CA, United States
This role focuses on the development and industrialization of advanced RF System-in-Package (SiP) technologies.
About the role
This role is for a Senior Manager, Package Process Development, responsible for leading the development and industrialization of advanced RF System-in-Package (SiP) technologies. This includes driving package process innovation and establishing manufacturing processes for high-volume production of RF modules and SiP products.
What you'll do
- Lead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.
- Own development and optimization of RF SiP assembly processes, including Die Attach, Flip Chip Assembly, Wire Bonding, Wafer-Level Packaging Integration, Underfill, Encapsulation/Molding, Shielding Processes, SMT, and Board-Level Assembly.
- Lead Design of Experiments (DOE), process characterization, root cause analysis, and yield improvement initiatives.
- Drive process development activities from concept through production release and ramp-up.
- Partner with reliability and quality engineering teams to ensure package/process robustness and define package qualification requirements.
- Build and lead a high-performing package process development team, providing technical mentorship.
What you'll need
- MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or Chemical Engineering.
- 12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.
- Strong hands-on experience in RF SiP package development and assembly process engineering.
- Proven track record of successfully launching new package technologies into mass production.
- Deep understanding of semiconductor package assembly processes and equipment.
- Experience with NTI programs and technology transfer to manufacturing.
- Strong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.
- Experience working with OSATs and external manufacturing partners.
Nice to have
- Extensive experience with RF front-end modules, wireless communication products, or advanced SiP technologies.
- Knowledge of RF performance impacts associated with package structures and assembly processes.
- Experience with advanced packaging technologies such as Fan-Out Packaging, Wafer-Level Packaging (WLP), Panel-Level Packaging (PLP), Heterogeneous Integration, Multi-Chip Modules (MCM), and Embedded Component Technologies.
- Strong understanding of package reliability physics and failure mechanisms.
- Experience supporting automotive, mobile, Wi-Fi, Bluetooth, GNSS, or cellular RF products.
This role has been open 2 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
53 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (302 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 107 | 9358 · 108 employers |
| Median days open | 9 d | 53 d (−44 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 99 d
- Micron Technology · 36 open roles · median 26 d
- Renesas Electronics · 22 open roles · median 18 d
- Infineon Technologies · 20 open roles · median 38 d
- Intel Corporation · 14 open roles · median 58 d
- Lumilens · 13 open roles · median 42 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.