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Eridu AI

Package Layout Design Engineer

Eridu AI Saratoga, CA, United States Full-time 5 hours ago
Packaging & Advanced Integration

About the role

Eridu AI is seeking a Package Layout Design Engineer to work on advanced packaging and interconnect infrastructure for AI data centers.

What you'll do

  • Execute package layout design across complex multi-die and substrate architectures.
  • Collaborate with silicon, systems, and supply chain partners on package design integration and implementation.
  • Address communication and interconnect bottlenecks through package-level layout solutions.

What you'll need

  • Professional experience in semiconductor package layout design.
  • Technical background in substrate layout and advanced packaging techniques.
  • Experience collaborating with cross-functional silicon and hardware engineering teams.

Skills: substrate layout, packaging, AI data centers, chiplet, interconnect

More semiconductor jobs: Advanced packaging jobs · California jobs

Market context

This role has been open 186 days — well above the 93-day median for Chiplet/Advanced Packaging Design roles.

Chiplet/Advanced Packaging Design · Chiplet Interconnect

Open roles in category
42
Median days open
93 d
Category median salary (all employers)
$215k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Eridu AI compares in Chiplet/Advanced Packaging Design hiring
Metric Eridu AI All employers we track in this specialty (42 roles · 18 employers)
Open roles in this specialty 1 42
Median days open 186 d 93 d (+93 d vs this employer)
Median salary (USD postings) — $215k

Skills observed across this category: substrate layout, packaging, AI data centers, chiplet, interconnect

Who's hiring in this category

  • Marvell Technology · 7 open roles · median 46 d
  • Micron Technology · 5 open roles · median 158 d
  • Intel Corporation · 4 open roles · median 52 d
  • NVIDIA · 4 open roles · median 87 d
  • Qualcomm · 4 open roles · median 123 d
  • AMD · 3 open roles · median 93 d

How we counted: 42 open Chiplet/Advanced Packaging Design (Chiplet Interconnect) roles from 18 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.

Eridu AI

Eridu AI

Apply now
Saratoga, CA, United States
On-site
Full-time
5 hours ago

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