Package Design Electrical Engineer - Austin (Oakhill, Office), United States
Originally posted 1 October 2026 by the employer.
This role focuses on IC packaging solutions and new packaging technology for NXP products with working frequencies from DC to 100GHz plus, including Radar or 6G applications.
About the role
This role is responsible for providing optimized package design solutions for New Product and New Technology Introductions (NPI, NTI) and defining packages that meet product requirements for electrical performance, manufacturability, and cost.
What you'll do
- Provide optimized package design solutions for New Product and New Technology Introductions (NPI, NTI).
- Define packages that meet product requirements for electrical performance, manufacturability, and cost.
- Run Electromagnetic (EM) modeling tools to ensure package performance and document modeling results.
- Work with business line System on Chip (SoC) and Printed Circuit Board (PCB) teams to optimize package solutions.
- Provide electrical design rules to Package Design Layout (PDL) team and optimize package layout using electrical modeling data to improve IO interface and power performance.
- Provide package electrical data or models to BL team for system level simulation.
What you'll need
- MSEE with experience in microelectronics packaging design and EM modeling.
- Understanding of electrical design of various IO interfaces (e. g. LVDS, DDR, SerDes).
- Excellent written and verbal communication and presentation skills.
Nice to have
- EM educational background, proficient on EM modeling and simulation tools (HFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADS, Cadence Signal and power integrity tools).
- Radio Frequency (RF) design experience, RF and multiple GHz wired & wireless modeling experience, and antenna modeling experience.
- PCB design experience or worked with PCB designer.
- Knowledge on die level Back End of Line (BEOL) design.
Skills: package design, EM modeling, HFSS, Q3D, SerDes
This role has been open 3 days — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
195
|
Median days open
61 d
|
Median salary
$163k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | NXP Semiconductors | All employers we track in this specialty (195 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 195 |
| Open roles in the wider Process, Fab & Equipment family | 114 | 9571 · 109 employers |
| Median days open | 32 d | 61 d (−29 d vs this employer) |
| Median salary (USD postings) | — | $163k |
Skills observed across this category: package design, EM modeling, HFSS, Q3D, SerDes
Who's hiring in this category
- Infineon Technologies · 26 open roles · median 45 d
- Renesas Electronics · 23 open roles · median 37 d
- Micron Technology · 17 open roles · median 151 d
- onsemi · 13 open roles · median 18 d
- Monolithic Power Systems · 11 open roles · median 198 d
- Intel Corporation · 8 open roles · median 173 d
How we counted: 195 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 4 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.