Optomechanical Engineer, Semiconductor Packaging Tools - Austin
Originally posted 14 September 2026 by the employer — open 3 days.
About the role
This role involves developing the complete set of tools and processes for fabricating semiconductor packaging devices. You will be instrumental in developing hardware and optimizing processes that create innovative packaging solutions.
What you'll do
- Own optomechanical system development from concept through operation, including mechanical design, optical layout, precision assembly, wiring, controls integration, alignment, and debug.
- Develop laser micromachining processes and equipment, including vision-based alignment and inspection systems.
- Create and validate novel IC packaging processes, from early experiments through repeatable multi-step process flows.
- Plan and execute experiments across deposition, etch, lithography, bonding, die attach, and related packaging processes.
- Collaborate closely with process, mechanical, electrical, controls, and software engineers.
- Create and maintain design documentation, experiment records, operating procedures, and equipment maintenance requirements.
What you'll need
- Hands-on experience designing, building, integrating, or fundamentally modifying process equipment or scientific instruments.
- Experience with optomechanical system design and integration, including mechanical design, optics, precision assembly, wiring, controls, alignment, and system debug.
- Experience developing laser micromachining processes and working with vision-based alignment systems.
- Proficiency in metrology and failure analysis, including developing custom tools or methods.
- Ability to work independently in an R&D environment and take ownership from initial concept through functional hardware and validated process results.
Nice to have
- Experience with metal plating.
- Exposure to advanced semiconductor packaging technologies, including interposers, through-vias, redistribution layers (RDL), hybrid bonding, thermocompression bonding, flip chip, and underfill.
- Experience with ultrafast laser micromachining.
This role has been open 3 days — well below the 52-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
52 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Atomic Semi | All employers we track in this specialty (299 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 25 | 9320 · 108 employers |
| Median days open | 11 d | 52 d (−41 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Who's hiring in this category
- KLA Corporation · 50 open roles · median 98 d
- Micron Technology · 32 open roles · median 29 d
- Renesas Electronics · 22 open roles · median 17 d
- Infineon Technologies · 21 open roles · median 37 d
- Intel Corporation · 15 open roles · median 57 d
- Lumilens · 13 open roles · median 41 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 17 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.