NPI Die Attach Process Technician - Calamba, Philippines
Originally posted 9 September 2026 by the employer — open 11 days.
Focus on the die attach process for new product introduction.
About the role
This role involves supporting the development and validation of new process bricks on the die attach process by establishing robust process settings, materials, and equipment capability.
What you'll do
- Load materials, configure recipes, and operate die attach machines (epoxy, or solder) per work instructions.
- Create die attach recipes for new process bricks for LGA, BGA, QFN, and flip chip packages.
- Monitor processes and execute tasks for resolving major process issues utilizing expertise in the Assy process.
- Ensure proactive quality compliance of new products, analyze root causes, and recommend corrective actions.
- Identify and resolve machine errors and implement corrective actions for defects.
- Support Die attach Engineer on DOE activities, set-up, DOE runs, and data gathering for new process brick development.
What you'll need
- Associate degree or technical/vocational diploma in electronics, mechanical engineering, or a related field.
- Minimum 1–3 years of experience in a die attach process on semiconductor manufacturing.
- Familiarity with pick-and-place systems, dispensing mechanisms, and microscopic inspection.
- Knowledgeable in ESEC 2100, ASM 8912, ASM838, Datacon, and Stencil printing equipment.
- Strong problem-solving abilities.
Skills: die attach process, new process bricks, equipment setup, process monitoring, troubleshooting
This role has been open 9 days — well below the 66-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
66 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | STMicroelectronics | All employers we track in this specialty (196 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 261 | 9314 · 108 employers |
| Median days open | 66 d | 66 d (same as this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: die attach process, new process bricks, equipment setup, process monitoring, troubleshooting
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 31 d
- Micron Technology · 19 open roles · median 142 d
- Renesas Electronics · 19 open roles · median 24 d
- Intel Corporation · 12 open roles · median 148 d
- Monolithic Power Systems · 12 open roles · median 184 d
- onsemi · 7 open roles · median 64 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.