Originally posted 12 September 2026 by the employer — open 0 days.
About the role
This role is accountable for the execution of global, cross-functional programs from concept and feasibility through qualification, industrialization, and production release. The position focuses on automotive power semiconductor products, including SiC, IGBT, silicon power devices, and power modules.
What you'll do
- Define program scope, objectives, requirements, deliverables, and success criteria with stakeholders.
- Provide end-to-end leadership for large-scale automotive NPD programs spanning SiC, IGBT, silicon power devices, and power module technologies.
- Develop and maintain integrated program schedules, milestone plans, resource assumptions, dependencies, and critical paths.
- Manage program change requests by assessing impact and securing approval.
- Drive phase-gate readiness and ensure required deliverables, reviews, approvals, evidence, and closure actions are completed.
- Lead global cross-functional teams to resolve technical and execution issues while maintaining alignment to schedule, scope, quality, and customer commitments.
What you'll need
- Semiconductor process, device, package, module, product, or development engineering experience.
- Minimum 8 years of semiconductor or power electronics industry experience.
- At least 5 years of project or program management experience, or roles with a strong program-management component.
- Proven experience managing large, complex automotive New Product Development programs through qualification, industrialization, and production launch.
- Bachelor’s degree in engineering, science, or related technical field.
- Proficiency in Microsoft Excel and PowerPoint.
Nice to have
- Demonstrated experience with SiC, IGBT, silicon power devices, and power modules.
- Master’s degree.
- Project Management Professional (PMP) certification or equivalent formal program management training.
- Proficiency in Microsoft Project or comparable scheduling tools.
- Working knowledge of semiconductor wafer fabrication, device development, package development, assembly, qualification, reliability, manufacturing readiness, and product release processes.
- Expertise in waterfall and phase-gate program management methodologies, tools, and governance practices; familiarity with Agile methods.
Skills: NPD, program schedules, SiC, IGBT, automotive product development
This role has been open 0 days — well below the 47-day median for Technical Program Management roles.
Technical Program Management · Automotive IC
|
Open roles in category
47
|
Median days open
47 d
|
Median salary
—
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (47 roles · 9 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 47 |
| Median days open | 32 d | 47 d (−15 d vs this employer) |
| Median salary (USD postings) | — | — |
Skills observed across this category: NPD, program schedules, SiC, IGBT, automotive product development
Who's hiring in this category
- Mobileye · 16 open roles · median 37 d
- Renesas Electronics · 9 open roles · median 44 d
- NXP Semiconductors · 8 open roles · median 56 d
- Qualcomm · 4 open roles · median 79 d
- Infineon Technologies · 3 open roles · median 64 d
- onsemi (this employer) · 3 open roles · median 32 d
How we counted: 47 open Technical Program Management (Automotive IC) roles from 9 employers tracked in the SemiconductorJobs index, counted 12 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.