New College Grad - IC Package Layout Engineer - Boise, ID - Main Site, United States
Originally posted 9 September 2026 by the employer — open 12 days.
About the role
As an early-career IC Package Layout Engineer, you will contribute to the invention and implementation of advanced semiconductor packages used in Micron's memory and storage products.
What you'll do
- Develop IC package layouts for products including DDR, LPDDR, GDDR, NAND, and ASIC.
- Support feasibility studies, mechanical substrate layouts, and package design activities.
- Create and maintain PCB and IC Package Libraries (footprint creation).
- Participate in layout reviews with cross-functional engineering teams.
- Perform Build Rules Checks (DRC) and utilize validation tools.
- Collaborate with Package Design, Signal Integrity, Product Engineering, Assembly, and CAD teams.
What you'll need
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related engineering field.
- Graduation within the last 12 months or expected graduation prior to start date.
- Strong analytical and problem-solving skills.
- Strong verbal and written communication skills.
- Ability to work effectively in a collaborative, cross-functional environment.
Nice to have
- Coursework, internship, co-op, or project experience related to PCB design, IC package design, electronics, or semiconductor technologies.
- Exposure to CAD or EDA design tools.
- Basic understanding of signal integrity (SI) and power integrity (PI) concepts.
- Experience with scripting or automation tools such as Python or similar languages.
- Demonstrated leadership through student organizations, projects, research, or internships.
Skills: IC package layouts, DDR, LPDDR, NAND, package design
This role has been open 12 days — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
194
|
Median days open
68 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (194 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 17 | 194 |
| Open roles in the wider Process, Fab & Equipment family | 1462 | 9417 · 108 employers |
| Median days open | 144 d | 68 d (+76 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: IC package layouts, DDR, LPDDR, NAND, package design
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 33 d
- Renesas Electronics · 20 open roles · median 25 d
- Micron Technology (this employer) · 17 open roles · median 144 d
- Intel Corporation · 12 open roles · median 150 d
- Monolithic Power Systems · 12 open roles · median 186 d
- onsemi · 7 open roles · median 66 d
How we counted: 194 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.