Mold Process Engineer - Bayan Lepas, my, Malaysia
Originally posted 14 September 2026 by the employer — open 4 days.
About the role
This role involves developing, optimizing, and controlling molding processes to achieve high product quality, yield, and manufacturing efficiency.
What you'll do
- Develop and maintain process specifications, work instructions, FMEA, Control Plans, KPIV/KPOV, and troubleshooting guides.
- Support continuous improvement, cost reduction, automation, and productivity initiatives.
- Evaluate new mold compounds, mold tooling, and process technologies for reliability and manufacturability.
- Collaborate with equipment, quality, maintenance, and production teams to implement corrective and preventive actions.
- Support new package and product qualifications, process transfers, and customer requirements.
What you'll need
- Bachelor's degree in Mechanical, Manufacturing, Materials, Chemical, or Electrical Engineering.
- Experience with transfer molding, compression molding, or injection molding processes.
- Knowledge of DOE, SPC, FMEA, PFMEA, Control Plan, and problem-solving methodologies (8D, RCA, Six Sigma).
- Strong analytical and troubleshooting skills.
Nice to have
- Experience in semiconductor packaging or transfer molding manufacturing.
Skills: transfer molding, compression molding, injection molding, semiconductor packaging, process specifications
This role has been open 4 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
65 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (199 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 19 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9328 · 108 employers |
| Median days open | 23 d | 65 d (−42 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: transfer molding, compression molding, injection molding, semiconductor packaging, process specifications
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 19 open roles · median 141 d
- Renesas Electronics (this employer) · 19 open roles · median 23 d
- Intel Corporation · 12 open roles · median 147 d
- Monolithic Power Systems · 12 open roles · median 183 d
- onsemi · 7 open roles · median 63 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.