Modeling Engineering Intern - Barcelona, ES, Spain
Originally posted 2 September 2026 by the employer.
About the role
This internship involves learning about Design Rules and Assembly Processes and applying various simulation techniques within Qorvo's Global Operations business group.
What you'll do
- Learn about Design Rules and Assembly Processes.
- Support quality assurance processes and lifetime prediction simulations.
- Utilize electrical, mechanical and thermal simulation techniques.
- Use supporting software for documentation, queue handling and metrics.
- Participate in onsite hands-on learning of semiconductor assembly processes.
- Assist with documentation and continuous improvement activities.
What you'll need
- BS in Materials Science, Mechanical Engineering or Physics.
- Mechanical/Material Engineering skills.
- Communication and presentation skills.
- Ability to manage and drive problem resolution.
- Strong analytical thinking skills.
- 3.0 GPA or higher.
Skills: Design Rules and Assembly Processes, lifetime prediction simulations, electrical, mechanical and thermal simulation, semiconductor assembly processes, Materials Science
This role has been open 54 days — below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
214
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (214 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 214 |
| Open roles in the wider Process, Fab & Equipment family | 64 | 10125 · 107 employers |
| Median days open | 78 d | 58 d (+20 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: Design Rules and Assembly Processes, lifetime prediction simulations, electrical, mechanical and thermal simulation, semiconductor assembly processes, Materials Science
Who's hiring in this category
- Renesas Electronics · 30 open roles · median 39 d
- Infineon Technologies · 25 open roles · median 43 d
- Micron Technology · 21 open roles · median 42 d
- onsemi · 17 open roles · median 32 d
- Intel Corporation · 11 open roles · median 111 d
- Monolithic Power Systems · 11 open roles · median 221 d
How we counted: 214 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.