Modeling Engineering Intern - Barcelona, ES, Spain
Originally posted 2 September 2026 by the employer — open 8 days.
About the role
This internship involves learning about Design Rules and Assembly Processes and applying various simulation techniques within Qorvo's Global Operations business group.
What you'll do
- Learn about Design Rules and Assembly Processes.
- Support quality assurance processes and lifetime prediction simulations.
- Utilize electrical, mechanical and thermal simulation techniques.
- Use supporting software for documentation, queue handling and metrics.
- Participate in onsite hands-on learning of semiconductor assembly processes.
- Assist with documentation and continuous improvement activities.
What you'll need
- BS in Materials Science, Mechanical Engineering or Physics.
- Mechanical/Material Engineering skills.
- Communication and presentation skills.
- Ability to manage and drive problem resolution.
- Strong analytical thinking skills.
- 3.0 GPA or higher.
Skills: Design Rules and Assembly Processes, lifetime prediction simulations, electrical, mechanical and thermal simulation, semiconductor assembly processes, Materials Science
This role has been open 7 days — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
201
|
Median days open
68 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (201 roles · 45 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 201 |
| Open roles in the wider Process, Fab & Equipment family | 50 | 9211 · 109 employers |
| Median days open | 10 d | 68 d (−58 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Skills observed across this category: Design Rules and Assembly Processes, lifetime prediction simulations, electrical, mechanical and thermal simulation, semiconductor assembly processes, Materials Science
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 22 open roles · median 132 d
- Renesas Electronics · 18 open roles · median 39 d
- Monolithic Power Systems · 12 open roles · median 174 d
- Intel Corporation · 11 open roles · median 139 d
- onsemi · 6 open roles · median 86 d
How we counted: 201 open Packaging Engineering (Packaging) roles from 45 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.