Micro Assembly Process Engineer - Livermore, CA, United States
Originally posted 31 August 2026 by the employer.
About the role
This role involves leading troubleshooting and repair of complex probe cards and sub-assemblies, and supporting manufacturing engineering activities. The position focuses on micro assembly processes, new product introduction (NPI), and continuous process improvement (CPI).
What you'll do
- Lead troubleshooting and repair of complex probe cards and sub-assemblies.
- Support Manufacturing Engineering activities, recognizing and prioritizing improvement opportunities.
- Coach and train technicians, and perform operator Core trainer training and certification.
- Participate in tests and experiments to improve production processes or develop new products.
- Support modifications of automated assembly systems process, alignment measurement parameters, and create/modify procedures.
- Project manage and participate in assembly equipment hardware and software upgrades based on process quality and throughput objectives.
- Participate in equipment capacity increases, CapEx Projects, and product related tooling capacity increases.
What you'll need
- Bachelor's degree or foreign equivalent in Manufacturing Engineering, Mechanical Engineering or related field.
- 5 years of progressive experience as Field Service/Application Engineer, Quality Control Engineer, or related occupation.
- At least 1 year of work experience managing medium-to-complex analysis models in JMP, including process data, yield analysis, implement quality controls and DOEs using statistical program software.
- At least 1 year of work experience troubleshooting probe cards issues for all components.
- At least 1 year of work experience with NPI (new product introduction) processes and equipment assessment and customization.
- At least 1 year of work experience with Micro assembly process and equipment performance CPI (continuous process improvement) to lead improvement projects.
- At least 1 year of work experience using microscopes, micromanipulators, and metrology tools.
- At least 1 year of work experience troubleshooting and repairing precision electromechanical assemblies using root cause analysis techniques and standard measurement instruments.
- At least 1 year of work experience transferring process from early stage of development to LVM (Low Volume Manufacturing) and HVM (High Volume Manufacturing).
- At least 1 year of work experience with dimensional inspection and alignment verification using metrology tools: optical measurement systems, calipers, micrometers, and dial indicators.
- At least 1 year of work experience establishing HVM processes including documentation, requirements, specifications, and manufacturing work instructions.
This role has been open 23 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | FormFactor | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 112 | 9525 · 109 employers |
| Median days open | 58 d | 58 d (same as this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.