$81,000 - $111,000 USD yearly
Originally posted 26 August 2026 by the employer — open 14 days.
Join the Bond & Grind Engineering team at the Mohawk Valley Fab (MVF) to work with 200mm SiC wafer fabrication.
About the role
This role involves sustaining, optimizing, and improving temporary bonding and wafer thinning systems used in the manufacture of silicon carbide power devices. You will join the Bond & Grind Engineering team at the Mohawk Valley Fab, the world's largest 200mm SiC wafer fabrication facility.
What you'll do
- Conduct preventive maintenance (MTBPM), tool fingerprinting, and CIPs to achieve tool availability goals.
- Troubleshoot chemical delivery sub-systems and perform root cause analysis (RCA) on equipment excursions.
- Create and maintain PM procedures, tool configuration records, and tool acceptance specifications.
- Support tool selection decisions for capacity increases and process development/transfer.
- Partner with process engineering and production to improve quality metrics, reduce scrap and rework, and drive cost reduction.
- Manage spare parts inventory and equipment BOMs, and coordinate with vendors on technical escalations, parts sourcing, and field service support.
What you'll need
- Bachelor’s degree in mechanical engineering.
- 5+ years of semiconductor or manufacturing experience.
- Hands-on experience sustaining and troubleshooting equipment in a manufacturing environment.
- Proficiency in technical writing and presentations.
This role has been open 14 days — well below the 45-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Manufacturing Equipment
|
Open roles in category
3537
|
Median days open
45 d
|
Median salary
$128k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Wolfspeed | All employers we track in this specialty (3537 roles · 82 employers) |
|---|---|---|
| Open roles in this specialty | 19 | 3537 |
| Open roles in the wider Process, Fab & Equipment family | 55 | 9211 · 109 employers |
| Median days open | 33 d | 45 d (−12 d vs this employer) |
| Median salary (USD postings) | — | $128k |
Who's hiring in this category
- Applied Materials · 597 open roles · median 44 d
- Lam Research · 536 open roles · median 34 d
- KLA Corporation · 219 open roles · median 51 d
- Micron Technology · 192 open roles · median 41 d
- ASML · 181 open roles · median 58 d
- ASM International · 135 open roles · median 71 d
How we counted: 3537 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 82 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.