Manager, Process Engineering - PECVD
Originally posted 21 October 2026 by the employer.
About the role
The Manager, Process Engineering leads a team of process engineers within the PECVD (Plasma Enhanced Chemical Vapor Deposition) KPU to drive process technology development, customer deliverables, and productivity improvements. The role supports process development, optimization, characterization, and customer demonstrations for semiconductor logic, memory, and advanced packaging applications.
What you'll do
- Lead, develop, and manage a team of process engineers focused on PECVD thin film applications for logic, memory, and advanced semiconductor devices. - Establish team priorities, allocate resources, and oversee the development, optimization, and qualification of PECVD processes. - Lead root cause analysis and problem-solving activities related to process performance, yield, integration, and productivity. - Collaborate with R&D, Product Engineering, Product Management, and Hardware Engineering teams on process solutions and technology roadmaps. - Partner directly with global customers to understand technical requirements, support evaluations, and enable process transfers into manufacturing. - Manage project planning and prioritization of wafer processing, characterization activities, and customer deliverables.
What you'll need
- Master's degree or Ph.D. in Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline. - 8+ years of semiconductor process engineering experience with significant focus on thin film deposition technologies. - Prior people management experience or demonstrated success leading technical teams and cross-functional projects. - Strong technical background in PECVD, CVD, ALD, or related thin film deposition technologies. - Experience developing and optimizing semiconductor processes for logic, memory, advanced packaging, or specialty semiconductor applications.
Nice to have
- Experience with dielectric films, nitrides, oxides, low-k materials, or other advanced thin film applications. - Background in plasma processes and plasma-material interactions. - Experience working directly with semiconductor customers in a process development or applications engineering role. - Familiarity with statistical process control (SPC), DOE methodologies, and advanced data analytics techniques. - Experience supporting technology transfers from development into high-volume manufacturing. - Understanding of semiconductor device physics, process integration, and manufacturing challenges.
Skills: PECVD, thin film, deposition, CVD, ALD
This role has been open 0 days — well below the 50-day median for Process Engineering roles.
Process Engineering · Deposition Process
|
Open roles in category
67
|
Median days open
50 d
|
Median salary
$142k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | ASM International | All employers we track in this specialty (67 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 67 |
| Open roles in the wider Process, Fab & Equipment family | 264 | 10066 · 107 employers |
| Median days open | 42 d | 50 d (−8 d vs this employer) |
| Median salary (USD postings) | — | $142k |
Skills observed across this category: PECVD, thin film, deposition, CVD, ALD
Who's hiring in this category
- Micron Technology · 18 open roles · median 32 d
- Lam Research · 12 open roles · median 23 d
- ASM International (this employer) · 10 open roles · median 63 d
- STMicroelectronics · 5 open roles · median 23 d
- Applied Materials · 3 open roles · median 23 d
- Vishay Intertechnology · 2 open roles · median 98 d
How we counted: 67 open Process Engineering (Deposition Process) roles from 21 employers tracked in the SemiconductorJobs index, counted 21 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.