$25 - $31 USD yearly
Originally posted 7 September 2026 by the employer — open 14 days.
About the role
This internship involves assisting with the design and development of HiRel application packages and supporting process development activities.
What you'll do
- Assist with the design and development of HiRel application packages.
- Support process development activities to ensure robust manufacturing workflows.
- Understand and ensure compliance with quality standards in packaging development.
- Utilize CAD software and 3D modeling tools to create packaging solutions.
- Work with cross-functional teams to drive packaging activities and achieve project goals.
- Ensure all safety requirements and protocols are followed during project execution.
What you'll need
- Actively pursuing a Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related field.
- Familiarity with CAD software (e.g., SolidWorks, AutoCAD, or similar) and 3D modeling tools.
- Basic understanding of material properties and selection, especially those used in high-reliability (HiRel) environments.
- Awareness of quality control processes and standards in the context of packaging and manufacturing.
- Ability to analyze problems, troubleshoot, and contribute to process improvements.
- US citizen or green card holder.
Skills: HiRel application packages, Process Development, CAD Modeling, 3D modeling tools, quality standards
This role has been open 13 days — well below the 67-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
67 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (196 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 27 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 321 | 9346 · 108 employers |
| Median days open | 32 d | 67 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: HiRel application packages, Process Development, CAD Modeling, 3D modeling tools, quality standards
Who's hiring in this category
- Infineon Technologies (this employer) · 27 open roles · median 32 d
- Micron Technology · 19 open roles · median 143 d
- Renesas Electronics · 19 open roles · median 25 d
- Intel Corporation · 12 open roles · median 149 d
- Monolithic Power Systems · 12 open roles · median 185 d
- onsemi · 7 open roles · median 65 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.