$29 - $49 USD hourly
This co-op focuses on integrated circuit (IC) packaging.
About the role
This co-op student role within the Skyworks Packaging team focuses on IC packaging process flow and supports the development and reliability assessment of advanced semiconductor packages through thermal and mechanical finite element analysis (FEA).
What you'll do
- Work with engineers to understand package structures, materials, and manufacturing processes.
- Use finite element analysis (FEA) tools such as ANSYS to evaluate package behavior.
- Support analysis of package warpage, stress, deformation, and temperature distribution.
- Prepare engineering reports, presentations, and summaries of simulation findings.
- Develop basic automation scripts or data analysis tools using ANSYS APDL scripting / Python or similar software.
- Collaborate with cross-functional teams including package design, reliability, process, and product engineers.
What you'll need
- Pursuing a Ph.D. degree in Mechanical Engineering, Materials Science, Aerospace Engineering, Engineering Physics, or a related field.
- Basic understanding of mechanics, heat transfer, and engineering fundamentals.
- Strong analytical and problem-solving skills.
- Eagerness to learn semiconductor packaging technologies and simulation methodologies.
Nice to have
- Exposure to CAD, FEA, Python, or other engineering software.
More semiconductor jobs: Hardware design jobs · Irvine jobs
This role has been open 81 days — well above the 46-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1126
|
Median days open
46 d
|
Category median salary (all employers)
$150k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (1126 roles · 109 employers) |
|---|---|---|
| Open roles in this specialty | 14 | 1126 |
| Open roles in the wider Software, Firmware & Systems family | 57 | 6531 · 156 employers |
| Median days open | 74 d | 46 d (+28 d vs this employer) |
| Median salary (USD postings) | — | $150k |
Who's hiring in this category
- Intel Corporation · 88 open roles · median 33 d
- KLA Corporation · 66 open roles · median 59 d
- Applied Materials · 60 open roles · median 40 d
- ASML · 59 open roles · median 17 d
- NVIDIA · 58 open roles · median 74 d
- Teradyne · 58 open roles · median 51 d
How we counted: 1126 open Hardware Systems Engineering (AI ML Hardware) roles from 109 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.