IC Packaging Design Engineer, Amazon Leo - San Diego, California, United States
Originally posted 8 September 2026 by the employer — open 13 days.
Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites.
About the role
This role involves designing innovative product solutions for mm-wave beamforming SoCs and front-end modules, with a focus on power-optimized packaging solutions for Amazon Leo.
What you'll do
- Collaborate with digital design and RF chip designers to define floorplans, bump maps, and ball maps for beamforming ICs.
- Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
- Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN.
- Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify designs.
- Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
What you'll need
- Experience in package design for mm-wave beamforming SoCs and front-end modules.
- Ability to collaborate with digital design and RF chip designers.
- Experience with package types such as FCBGA, FCCSP, WLCSP, QFN.
- Proficiency with 3D electromagnetic simulations in tools like HFSS and Momentum.
- Knowledge of signal integrity checks, crosstalk, and coupling.
- Understanding of qualification of packages including HAST, HTOL, and board level reliability.
Skills: IC Packaging Design, mm-wave beamforming SoCs, FCBGA, HFSS, 3D electromagnetic simulations
This role has been open 12 days — well below the 38-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
67
|
Median days open
38 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Amazon | All employers we track in this specialty (67 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 67 |
| Median days open | 26 d | 38 d (−12 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Skills observed across this category: IC Packaging Design, mm-wave beamforming SoCs, FCBGA, HFSS, 3D electromagnetic simulations
Who's hiring in this category
- Micron Technology · 13 open roles · median 143 d
- AMD · 6 open roles · median 27 d
- Marvell Technology · 6 open roles · median 13 d
- Broadcom · 5 open roles · median 163 d
- NVIDIA · 5 open roles · median 38 d
- Amazon (this employer) · 4 open roles · median 26 d
How we counted: 67 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.