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Micron Technology

High Bandwidth Memory Design Architect - E1 to SMTS - Richardson, TX, United States

Micron Technology Richardson, TX, United States Full-time 1 day ago
Digital Design & SoC Architecture

Originally posted 28 October 2026 by the employer.

About the role

As an HBM Design Architect in the Heterogeneous Integration Group (HIG) HBM Architecture team, you will contribute to analysis, modeling, and pathfinding for future High Bandwidth Memory products. You will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability.

What you'll do

- Analyze HBM and DRAM architectures using analytical models, simulations, silicon data, and AI-assisted techniques to evaluate timing, bandwidth, power, area, thermal performance, reliability, and design complexity. - Develop and apply modeling, simulation, and data-analysis methodologies to assess alternative architectural approaches, identify design sensitivities, and support technology pathfinding. - Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate implementation feasibility, performance tradeoffs, signal integrity, power delivery, and manufacturability considerations. - Perform root-cause analysis using simulation and measured data to improve model accuracy, validate assumptions, and provide evidence-based design recommendations. - Communicate technical findings through presentations, design reviews, architecture discussions, and written documentation.

What you'll need

- Degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date. - Foundation in at least two of the following areas: CMOS circuits, analog or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging. - Experience developing engineering models, simulations, or analytical methodologies through job experience or university-related work. - Demonstrated ability to evaluate complex technical problems, draw evidence-based conclusions, and communicate recommendations to multidisciplinary teams.

Nice to have

- Work experience, graduate research, internship, thesis, dissertation, or project experience related to HBM, DRAM, SRAM, memory controllers, high-speed interfaces, semiconductor architecture, or 3D integration technologies. - Experience with engineering simulation and analysis tools such as HSPICE, FineSim, Spectre, or similar circuit-design environments. - Understanding of power, performance, area, timing, thermal, and reliability tradeoffs in advanced semiconductor designs. - Experience using data analytics, AI, Large Language Models (LLMs), or Generative AI technologies to enhance engineering productivity, design exploration, or technical analysis. - Technical communication experience demonstrated through publications, conference presentations, patents, research reviews, or design reports.

Skills: HBM, DRAM, HSPICE, memory architecture, analytical modeling

Market context

This role has been open 0 days — well below the 70-day median for Memory Design roles.

Memory Design · Memory Design

Open roles in category
322
Median days open
70 d
Median salary
$200k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Micron Technology compares in Memory Design hiring
Metric Micron Technology All employers we track in this specialty (322 roles · 30 employers)
Open roles in this specialty 170 322
Median days open 81 d 70 d (+11 d vs this employer)
Median salary (USD postings) — $200k

Skills observed across this category: HBM, DRAM, HSPICE, memory architecture, analytical modeling

Who's hiring in this category

  • Micron Technology (this employer) · 170 open roles · median 82 d
  • Synopsys · 31 open roles · median 69 d
  • Qualcomm · 19 open roles · median 90 d
  • SanDisk · 17 open roles · median 56 d
  • Broadcom · 16 open roles · median 70 d
  • onsemi · 7 open roles · median 101 d

How we counted: 322 open Memory Design (Memory Design) roles from 30 employers tracked in the SemiconductorJobs index, counted 29 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.

Apply now
Richardson, TX, United States
On-site
Full-time
1 day ago

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