Graduate - Package Development Engineer - Leominster, MA, United States
$80,000 - $94,000 USD yearly
Originally posted 8 September 2026 by the employer — open 12 days.
About the role
This role involves leading package development, material selection, qualification, and new product introduction for the HiRel Package Group.
What you'll do
- Lead design, material selection, qualification, and new product introduction for the HiRel Package Group.
- Manage projects through prototype builds, learning cycles, and qualification builds.
- Ensure designs meet quality and reliability criteria for HiRel applications.
- Develop and sustain design rules, including Design for Manufacturing (DFM) standards.
- Partner with the package design team to release robust and reliable packages to production.
What you'll need
- Master's or PhD in Mechanical Engineering, Material Science, Chemical Engineering, or a related field, graduating in Spring 2027.
- Knowledge of process flows, upstream and downstream interactions, and design of experiments (DOE).
- Ability to identify unexpected issues, drive root-cause analysis, and persevere until closure.
- Experience in data analysis and continuous process improvement.
- US citizen or green card holder due to export control requirements.
Skills: package group, process development, qualification builds, design rules, DFM
This role has been open 12 days — well below the 67-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
67 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (196 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 27 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 321 | 9346 · 108 employers |
| Median days open | 32 d | 67 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: package group, process development, qualification builds, design rules, DFM
Who's hiring in this category
- Infineon Technologies (this employer) · 27 open roles · median 32 d
- Micron Technology · 19 open roles · median 143 d
- Renesas Electronics · 19 open roles · median 25 d
- Intel Corporation · 12 open roles · median 149 d
- Monolithic Power Systems · 12 open roles · median 185 d
- onsemi · 7 open roles · median 65 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.