Field Application Engineer (Automotive Embedded Software) - Shanghai, Pudong, ZuChongzhi, China
Originally posted 22 September 2026 by the employer — open 0 days.
About the role
This role involves joining the Automotive Field Applications team with a primary focus on automotive embedded software and customer-facing engineering tasks, specifically for ADI products. The engineer will be involved in system bring-up, software integration, and debugging.
What you'll do
- Support automotive embedded software development, integration, testing, and debugging.
- Independently handle customer platform bring-up, firmware and driver integration, software configuration, product evaluation, issue reproduction, and root-cause analysis.
- Develop and maintain embedded software demos, test programs, automation scripts, technical notes, and validation reports.
- Lead technical discussions, demonstrations, workshops, customer visits, and on-site troubleshooting.
- Work closely with Sales, Business Units, and engineering teams to track technical questions.
- Maintain and apply strong technical knowledge of automotive embedded software, MCU/DSP/SoC platforms, RTOS/Linux, automotive audio, networking, and ADI products.
What you'll need
- Master’s degree in Automotive Engineering, Vehicle Engineering, Electrical Engineering, Electronic Engineering, Computer Engineering, Automation, Computer Science, or a related discipline.
- At least three years of relevant industry experience in automotive embedded software, automotive electronics, semiconductor applications, or a related field.
- Good foundation in embedded software and proficiency in C/C++; knowledge of MCU, DSP, or SoC architecture, RTOS or embedded Linux, firmware, device drivers, debugging, or board bring-up.
- Proven hands-on capability in embedded software development, customer support, and system-level debugging, with the ability to independently analyze and resolve technical issues.
- Ability to explain technical observations clearly in Chinese and communicate in written and spoken English.
- Willingness to travel within China when needed.
Nice to have
- Knowledge or project experience in automotive audio, DSP, Ethernet, Automotive Ethernet, TSN/AVB, CAN, SPI, I2C, UART, I2S, or TDM.
Skills: field applications team, embedded software, customer support, firmware and driver integration, system bring-up
This role has been open 0 days — well below the 91-day median for Applications FAE roles.
Applications FAE · Automotive IC
|
Open roles in category
141
|
Median days open
91 d
|
Median salary
$152k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Analog Devices | All employers we track in this specialty (141 roles · 23 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 141 |
| Median days open | 82 d | 91 d (−9 d vs this employer) |
| Median salary (USD postings) | — | $152k |
Skills observed across this category: field applications team, embedded software, customer support, firmware and driver integration, system bring-up
Who's hiring in this category
- Infineon Technologies · 30 open roles · median 73 d
- NXP Semiconductors · 21 open roles · median 76 d
- Texas Instruments · 19 open roles · median 207 d
- Renesas Electronics · 15 open roles · median 181 d
- Microchip Technology · 10 open roles · median 184 d
- Qualcomm · 6 open roles · median 27 d
How we counted: 141 open Applications FAE (Automotive IC) roles from 23 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.