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AMD

FCT PD lead - Bangalore-Technostar B3, India

AMD IN, Bangalore-Technostar B3, India Full-time 6 days ago
Physical Design & EDA

Originally posted 29 September 2026 by the employer.

About the role

This role is responsible for developing, validating, and maintaining timing constraints and driving full-chip timing convergence for complex SoCs. The engineer will own SDC methodology and timing signoff quality.

What you'll do

  • Develop, validate, and maintain block, subsystem, and SoC-level timing constraints (SDC).
  • Perform comprehensive timing analysis and closure for full-chip and partition-level designs.
  • Analyze setup, hold, SI, OCV, AOCV, POCV, CDC-related, and mode-specific timing violations.
  • Debug timing issues originating from RTL, constraints, clock architecture, physical implementation, and ECO changes.
  • Own timing signoff readiness and ensure timing quality across all project deliverables.
  • Develop timing automation, QoR dashboards, and methodology improvements to improve closure efficiency.

What you'll need

  • Bachelor's or Master's degree in Electrical Engineering, Electronics, VLSI, Computer Engineering, or related field.
  • 7 to 10 years of experience in STA, Timing Closure, Constraints Development, or Physical Design.
  • Strong understanding of STA concepts including setup, hold, recovery, removal, SI, OCV, AOCV, and POCV.
  • Hands-on experience developing and validating SDC constraints.
  • Proficiency with Synopsys PrimeTime and timing signoff methodologies.
  • Proficiency in Tcl, Python, Perl, or Shell scripting.

Nice to have

  • Experience driving full-chip timing closure for large CPU, GPU, AI/ML, networking, or datacenter SoCs.
  • Expertise in constraint quality checks, timing signoff reviews, and correlation methodologies.
  • Knowledge of clock-domain crossings, asynchronous interfaces, and timing exception verification.
  • Experience with PrimeTime, PrimeTime-SI, Tempus, Fusion Compiler, or equivalent EDA tools.
  • Familiarity with low-power timing methodologies, UPF flows, and advanced-node signoff requirements.
  • Experience supporting tapeouts at 5nm, 4nm, 3nm, or newer process technologies.
  • Experience developing automation, AI-assisted timing analysis flows, and productivity-enhancing methodologies.

Skills: timing constraints, timing analysis, PrimeTime, SDC, timing signoff

Market context

This role has been open 0 days — well below the 64-day median for Physical Design roles.

Physical Design · Physical Design

Open roles in category
627
Median days open
64 d
Median salary
$185k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How AMD compares in Physical Design hiring
Metric AMD All employers we track in this specialty (627 roles · 79 employers)
Open roles in this specialty 43 627
Open roles in the wider Physical Implementation family 70 1420 · 109 employers
Median days open 28 d 64 d (−36 d vs this employer)
Median salary (USD postings) — $185k

Skills observed across this category: timing constraints, timing analysis, PrimeTime, SDC, timing signoff

Who's hiring in this category

  • Qualcomm · 114 open roles · median 40 d
  • AMD (this employer) · 44 open roles · median 28 d
  • Broadcom · 40 open roles · median 78 d
  • NVIDIA · 38 open roles · median 53 d
  • Synopsys · 27 open roles · median 56 d
  • NXP Semiconductors · 25 open roles · median 77 d

How we counted: 627 open Physical Design (Physical Design) roles from 79 employers tracked in the SemiconductorJobs index, counted 29 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Physical Implementation family row. Figures refresh nightly.

Apply now
IN, Bangalore-Technostar B3, India
On-site
Full-time
6 days ago

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