Failure Analysis Technician - USA-Arizona, United States
Originally posted 26 March 2026 by the employer.
Operate Dual-Beam FIB and TEM tools supporting N4, N3, and N2 process technology qualification and failure analysis.
About the role
As a Failure Analysis Technician at TSMC Arizona, you will support the Quality & Reliability team by performing failure analysis, sample preparation, and material characterization on semiconductor devices. Operations support fab processes including N4, N3, and N2 process technologies.
What you'll do
- Operate Dual-Beam FIB to prepare TEM samples or conduct materials analysis, including SIMS, XPS, and SEM imaging. - Operate TEM for imaging, analysis, and reporting. - Perform TEM sample preparation, including site marking, de-layering, applying protective coatings via spin coating and CVD tools, and executing pre-treatments. - Safely handle chemicals adhering to established PPE protocols and maintain 6S laboratory standards. - Collect, organize, and report analytical data to internal and external teams while assisting engineers with analytical method development. - Support fab manufacturing operations, work a compressed work week shift (day or night 12-hour shifts), and participate in the on-call schedule.
What you'll need
- Associate's degree (A.A.S.) from a Science, Engineering, or Technology program, or a related field. - Basic PC skills, including MS Windows OS and MS Office. - Ability to work in a cleanroom environment (Near-line FIB/TEM). - Ability and willingness to work 12-hour shifts (6am-6pm or 6pm-6am) in a compressed work week schedule, including nights, weekends, and overtime as needed.
Nice to have
- Experience in TEM sample preparation for semiconductor devices in advanced process nodes (<28nm). - TEM analysis experience in HR-STEM imaging and EDS analysis.
This role has been open 163 days — well above the 50-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
204
|
Median days open
50 d
|
Median salary
$107k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | TSMC Arizona | All employers we track in this specialty (204 roles · 40 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 204 |
| Open roles in the wider Process, Fab & Equipment family | 92 | 10039 · 106 employers |
| Median days open | 163 d | 50 d (+113 d vs this employer) |
| Median salary (USD postings) | — | $107k |
Who's hiring in this category
- Micron Technology · 43 open roles · median 51 d
- GlobalFoundries · 16 open roles · median 32 d
- Lam Research · 16 open roles · median 31 d
- Infineon Technologies · 13 open roles · median 31 d
- AMD · 9 open roles · median 92 d
- Intel Corporation · 9 open roles · median 70 d
How we counted: 204 open Failure Analysis Engineering (Failure Analysis) roles from 40 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.