Failure Analysis Engineer - Nanoprobing

Originally posted 17 April 2026 by the employer. Relisted by the employer on 13 August 2026.

About the role

This role focuses on the electrical characterization of semiconductor IC devices using nanoprobe systems. You will evaluate the electrical characteristics of integrated circuits and components to isolate and determine the root cause of design, reliability, and yield failures.

What you'll do

• Conduct electrical characterization of semiconductor IC devices using nanoprobe systems.
• Evaluate electrical characteristics and process acquired data using analytical tools to determine the root cause of failures.
• Analyze design, reliability, or yield failures down to the root cause.
• Collaborate with Product Engineering, Design Engineering, Quality Engineering, and Foundry Engineering teams globally.
• Provide technical training and support on nanoprobing and failure analysis techniques while maintaining experimental records.

What you'll need

• Bachelor's degree in Electrical Engineering, Electronics and Communications, Computer Science, Engineering, or a related field with 2+ years of Hardware Engineering or related experience (or a Master's degree with 1+ year of experience, or a PhD).
• Experience in electrical characterization and failure analysis of semiconductor IC devices.
• Understanding of integrated circuits, components, and root cause failure analysis.

Nice to have

• Hands-on experience in Nanoprobe Analysis.
• Theoretical knowledge of Digital/Analog CMOS circuits.
• Experience with CAD layout tools, including analyzing layouts and converting them to basic schematics.
• Understanding of circuit function and relation to failure signatures.
• Hands-on experience in semiconductor IC Failure Analysis, including structural debug (ATPG) for yield and fault isolation techniques.
• Master's degree in Electrical Engineering.

Skills: nanoprobing, failure analysis, electrical characterization, root cause analysis, IC debug