External Manufacturing NPI Engineer - Carmona, Cavite, Philippines
Originally posted 17 September 2026 by the employer — open 0 days.
About the role
This role involves owning backend external manufacturing New Product Introduction (NPI) from conceptualization through production launch, ensuring successful commercialization and market release.
What you'll do
- Own backend external manufacturing NPI from conceptualization, development, qualification to production launch.
- Deliver PLM requirements for new product commercialization and co-work with cross-functional teams for on-time market release.
- Drive DFM, technology, and manufacturability readiness for new package and complex derivative platforms.
- Partner with OSATs to deliver assembly readiness for new product qualification, including process flow & BOM setup, risk analysis, and process characterization.
- Manage production ramp, lead production safe launch, provide technical support for ramp issues, and develop CIP.
- Collaborate with internal & external partners for technology pathfinding, package roadmap, and design rules/guideline development.
What you'll need
- Bachelor's Degree in Engineering/Materials Science or equivalent technical background.
- More than 10 years of experience in backend semiconductor IC manufacturing with in-depth assembly process expertise and shop floor experience.
- Prior experience in NPI, product/process integration, and familiarity with Chip-to-Package Interaction (CPI) effect.
- Hands-on assembly process experience in leading wafer technology such as SiC, GaN.
- Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings.
- Proficient in statistical analysis methods and familiar with data analytics.
Skills: NPI, assembly process, OSATs, SiC, GaN, Chip-to-Package Interaction
This role has been open 0 days — well below the 52-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
52 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (299 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 13 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 270 | 9308 · 108 employers |
| Median days open | 20 d | 52 d (−32 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Skills observed across this category: NPI, assembly process, OSATs, SiC, GaN, Chip-to-Package Interaction
Who's hiring in this category
- KLA Corporation · 50 open roles · median 98 d
- Micron Technology · 32 open roles · median 29 d
- Renesas Electronics · 22 open roles · median 17 d
- Infineon Technologies · 21 open roles · median 37 d
- Intel Corporation · 15 open roles · median 57 d
- Lumilens · 13 open roles · median 41 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 17 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.