ENGR STAFF, PACKAGE DEV : PKG & ASSY - Carmona, Cavite, Philippines
Originally posted 16 September 2026 by the employer — open 1 day.
About the role
This role is responsible for new package development from conceptualization to fully functional prototypes, and for technology transfer to development sites.
What you'll do
- Conduct tests and research on basic materials and properties involved in packaging.
- Develop solutions and provide recommendations on technical approach and project timing.
- Conduct design reviews and risk assessments.
- Manage technical risks of assigned projects to ensure mitigation actions are deployed.
- Generate and present POC and technology demonstration reports to stakeholders.
- Transfer technology to development sites.
What you'll need
- Bachelor's or Master's degree in Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, or Electronics and Communications Engineering.
- 8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development.
- Hands-on assembly development and manufacturing experience.
- Analytical skills in process, materials, and assembly equipment parameters.
- Hands-on experience in program management.
Skills: new package development, assembly development, manufacturing experience, process parameters, materials parameters
This role has been open 0 days — well below the 52-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
52 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (299 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 271 | 9312 · 108 employers |
| Median days open | 50 d | 52 d (−2 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Skills observed across this category: new package development, assembly development, manufacturing experience, process parameters, materials parameters
Who's hiring in this category
- KLA Corporation · 50 open roles · median 98 d
- Micron Technology · 32 open roles · median 29 d
- Renesas Electronics · 22 open roles · median 17 d
- Infineon Technologies · 21 open roles · median 37 d
- Intel Corporation · 15 open roles · median 57 d
- Lumilens · 13 open roles · median 41 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 17 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.