Engineer, PDE PCS & MRDA - Fab 10A, Singapore
Originally posted 6 October 2026 by the employer. Relisted by the employer on 27 October 2026.
About the role
This role is responsible for developing, qualifying, deploying, and sustaining advanced defect inspection and metrology solutions for New Product Introduction (NPI), HBM technology ramps, and High Volume Manufacturing (HVM) in Advanced Packaging and Conventional Packaging technologies.
What you'll do
- Develop, qualify, deploy, and sustain advanced defect inspection and metrology solutions.
- Drive inspection capability readiness, equipment performance improvement, and defectivity reduction.
- Manage advanced inspection and metrology platforms throughout package development and manufacturing.
- Lead tool installation, qualification (TIQ), release, and production readiness activities.
- Set up defect metrics, observation methods, and continuous advancement plans.
- Manage and improve MRDA data systems and engineering applications for Advanced Packaging and Conventional Packaging technologies.
What you'll need
- Bachelor's Degree or equivalent experience in Engineering (Electrical, Mechanical, Mechatronics, Materials, Chemical Engineering, or related field).
- Deep understanding of semiconductor equipment performance, process integration, and manufacturing operations.
- Experience driving equipment qualifications, technology transfers, and manufacturing ramp readiness.
- Strong supplier management and collaborator engagement skills.
- Demonstrated ability to influence technical strategy across multiple organizations and sites.
- Ability to bring to bear AI, analytics, and automation to drive manufacturing excellence and efficiency.
Skills: inspection technology, metrology, equipment qualification, defectivity engineering, advanced packaging
This role has been open 21 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (295 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 41 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 1481 | 10125 · 107 employers |
| Median days open | 42 d | 63 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: inspection technology, metrology, equipment qualification, defectivity engineering, advanced packaging
Who's hiring in this category
- KLA Corporation · 42 open roles · median 138 d
- Micron Technology (this employer) · 39 open roles · median 45 d
- Intel Corporation · 20 open roles · median 30 d
- Renesas Electronics · 19 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 70 d
- Lumilens · 13 open roles · median 81 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.