Engineer I Process_Grinding and Lamination - Philippines - Mphil 3, Philippines
Originally posted 6 October 2026 by the employer.
About the role
This role is responsible for the development, characterization, qualification, and industrialization of wafer thinning technologies supporting advanced semiconductor packaging platforms. This includes focusing on developing robust backgrinding, wafer thinning, stress management, and wafer handling processes that enable high-yield, reliable, and manufacturable products.
What you'll do
- Lead the development and qualification of wafer backgrinding and thinning processes for new technology platforms and products.
- Establish process architecture, process windows, and technology roadmaps for wafer thinning applications.
- Evaluate and implement new grinding technologies, materials, consumables, and equipment solutions.
- Define process architecture, process flow, and critical process parameters to meet design, reliability, and manufacturability requirements.
- Lead process transfer from development to pilot and high-volume manufacturing.
What you'll need
- Bachelor's Degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, or Physics.
- Minimum 3 years of semiconductor manufacturing experience with direct experience in Backgrinding and Tape Lamination process.
- Experience with Engineering tools: Design of Experiment (DOE), Minitab or JMP, Statistical Process Control (SPC), FMEA, GRR, and Six Sigma tools.
- Familiarity with process characterization, recipe creation, and equipment or process troubleshooting.
- Knowledge of safety protocols and cleanroom practices.
Nice to have
- Strong experience with Fan-in and Fan-Out or advanced packaging tools.
Skills: wafer thinning, backgrinding, wafer-level packaging, tape lamination, thin wafer processing
This role has been open 21 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Microchip Technology | All employers we track in this specialty (295 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 118 | 10125 · 107 employers |
| Median days open | 21 d | 63 d (−42 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: wafer thinning, backgrinding, wafer-level packaging, tape lamination, thin wafer processing
Who's hiring in this category
- KLA Corporation · 42 open roles · median 138 d
- Micron Technology · 39 open roles · median 45 d
- Intel Corporation · 20 open roles · median 30 d
- Renesas Electronics · 19 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 70 d
- Lumilens · 13 open roles · median 81 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.