EMIB-T Substrate Program Integrator - Arizona, Phoenix, United States
Originally posted 31 August 2026 by the employer.
EMIB-T substrate technology development
About the role
This role involves leading EMIB-T substrate technology development and qualification activities within the Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization. You will ensure suppliers achieve readiness to support growing customer demand for EMIB-T substrate technology.
What you'll do
- Lead EMIB-T substrate technology development and qualification activities.
- Drive technical enablement for suppliers.
- Manage readiness milestones for substrate technology.
- Collaborate with cross-functional engineering teams, suppliers, and assembly platform partners.
- Ensure suppliers achieve required readiness for customer demand.
What you'll need
- Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
- Experience managing complex projects.
- Experience delivering results in TD/high-volume manufacturing environments.
Nice to have
- Foundation in advanced packaging, substrates, or semiconductor manufacturing.
- Leadership in supplier management or technology enablement.
- Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.
- Familiarity with characterization techniques such as X-ray, SEM, FTIR, and EDX.
- Experience with process flow development, FMEA, DOE design, and problem-solving tools.
- Experience with Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement.
This role has been open 23 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 13 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 177 | 9525 · 109 employers |
| Median days open | 64 d | 58 d (+6 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.