DMTS SiPh Packaging & Assembly Materials
$166,500 - $290,000 USD yearly
Originally posted 23 September 2026 by the employer.
About the role
This DMTS-grade position will drive GlobalFoundries' Si Photonics platform growth into fully packaged electro-optical transceiver offerings utilizing 2.5D and 3D co-packaged optics form factors.
What you'll do
- Serve as a technical subject matter expert for SiPhotonics packaging to build GlobalFoundries capability through shared knowledge training and recruitment efforts.
- Provide leadership and training to engineers in product packaging design reviews, materials selection, and FMEAs of customer packaging concepts.
- Ensure the maturity of technology, technology models, packaged design rules, and IP meet industry expectations.
- Ensure all new technologies and features meet standardized quality expectations for implementation into application representative packages for Data Centers, Automotive, and Communications.
- Drive GlobalFoundries leadership in global SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes.
What you'll need
- MS or PhD plus 20 or more years of experience.
- Expertise in photonic and electronic package architecture definition.
- Broad and deep knowledge of global technology and commercial trends related to current and future technology, design, or manufacturing.
- Experience in bringing packaged products from development into production for data centers, automotive, and communications.
- Expertise in chip package interaction for 2D, 2.5D, 3D SiPh advanced packaging.
Nice to have
- A record of distinguished leadership on national and international levels, such as contributing to national R&D agendas in science & technology, manufacturing.
- Participation in industry standards boards.
- Materials science, thermal, mechanical, simulation background.
- Extensive experience with failure analysis, design of experiments, and packaging process integration.
Skills: Si Photonics platform, electro-optical transceiver, 2.5D and 3D co-packaged optics, photonic interconnect, hybrid bonding, chip package interaction
This role has been open 0 days — well below the 79-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Chiplet Interconnect
|
Open roles in category
41
|
Median days open
79 d
|
Median salary
$217k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | GlobalFoundries | All employers we track in this specialty (41 roles · 19 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 41 |
| Median days open | 7 d | 79 d (−72 d vs this employer) |
| Median salary (USD postings) | — | $217k |
Skills observed across this category: Si Photonics platform, electro-optical transceiver, 2.5D and 3D co-packaged optics, photonic interconnect, hybrid bonding, chip package interaction
Who's hiring in this category
- Marvell Technology · 5 open roles · median 22 d
- Qualcomm · 5 open roles · median 86 d
- Micron Technology · 4 open roles · median 133 d
- NVIDIA · 4 open roles · median 45 d
- AMD · 3 open roles · median 48 d
- Intel Corporation · 3 open roles · median 20 d
How we counted: 41 open Chiplet/Advanced Packaging Design (Chiplet Interconnect) roles from 19 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.