Director, fcCSP BU (Advanced Packaging Product Engineer) - Tempe, AZ, United States
Originally posted 21 October 2026 by the employer.
About the role
This position manages product development, business strategy, pricing/cost controls, NPI engineering, and customer negotiations from inception through final qualification and production. The focus is on fcCSP technologies across package types including high performance computing and Grade 0, 1, 2, and Grade 3 Automotive.
What you'll do
- Partner with customer teams to understand assembly, reliability, and scheduling requirements for new package configurations and product introductions. - Apply knowledge of semiconductor packaging assembly and substrate technologies across concurrent New Product Introduction (NPI) programs. - Promote flip chip package portfolio technologies directly to customers to identify applications and secure new business. - Collaborate with factory teams to create detailed package and process risk assessments for NPI manufacturability and reliability, mitigating customer requirement cost drivers. - Develop and maintain detailed cost analyses on package types, process flows, and customer RFQs, delivering pricing inputs to management and sales. - Establish and maintain end-to-end packaging supply chains across bumping, probe test, assembly, and final test, focusing on substrate supply chains and US supplier development.
What you'll need
- Bachelor's Degree in a related engineering field (Mechanical, Chemical, Materials, or Electrical engineering). - At least 10 years of experience in the semiconductor industry. - Experience in a technical or business capacity in manufacturing or distribution within the semiconductor industry. - Technical project management experience, including working across offshore factories and multiplexing across concurrent programs. - Prior experience managing supplier relationships or direct customer-facing program management. - Proficiency in Excel, PowerPoint, and other MS Office software.
Nice to have
- Industrial Engineering course study or factory experience. - Exposure to substrate process technology. - Experience working with teams in Southeast Asia across multiple time zones. - Experience with mechanical test, material property test, reliability test, or failure analysis. - Experience with cost modeling, pricing, and quoting activities.
Skills: fcCSP, flip chip, packaging assembly, substrate, NPI
This role has been open 0 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
220
|
Median days open
57 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Amkor | All employers we track in this specialty (220 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 220 |
| Open roles in the wider Process, Fab & Equipment family | 51 | 10278 · 109 employers |
| Median days open | 0 d | 57 d (−57 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: fcCSP, flip chip, packaging assembly, substrate, NPI
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 37 d
- Infineon Technologies · 25 open roles · median 36 d
- Micron Technology · 20 open roles · median 77 d
- onsemi · 16 open roles · median 33 d
- Skyworks · 12 open roles · median 10 d
- Intel Corporation · 11 open roles · median 112 d
How we counted: 220 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.