Director, Chiplets/FCBGA Integration - Tempe, AZ, United States
Originally posted 3 February 2026 by the employer.
About the role
This position leads program management for the development of chiplet-based IC packages, including High Density Fan-out (HDFO) and advanced package constructions for computing, networking, and mobile applications. You will serve as the primary interface between Tier 1 customers and Amkor's R&D center in South Korea.
What you'll do
- Drive and coordinate package development activities with customers in conjunction with R&D development teams in Korea. - Lead Tier 1 customer interface meetings, discussions, and follow-up actions throughout the project development phase. - Manage cross-functional teams spanning R&D, Design, Characterization, and Simulation to execute projects on schedule. - Oversee customer product management through the development phase and into the initial production ramp.
What you'll need
- Bachelor's Degree in Engineering. - 10+ years of experience in semiconductor package development, with direct experience in IC Packaging. - Understanding of the IC package design environment and tradeoffs associated with package design during process development of FCBGA packages. - Working knowledge of mechanical stress/strain and IC package warpage. - Deep knowledge of IC packaging materials, failure modes, and reliability qualification procedures. - Ability to travel 10-20% domestically and internationally.
Nice to have
- Expertise in high-density fan-out (HDFO) or bridge-like chiplet module constructions, constraints, and tradeoffs. - Mechanical or thermal simulation experience. - Familiarity with Design of Experiments and Statistical Process Control. - Master's degree in Engineering, Mechanical Engineering, or Materials Science.
Skills: FCBGA, chiplet, warpage, HDFO, package development
This role has been open 0 days — well below the 62-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
62 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Amkor | All employers we track in this specialty (297 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 51 | 10278 · 109 employers |
| Median days open | 0 d | 62 d (−62 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: FCBGA, chiplet, warpage, HDFO, package development
Who's hiring in this category
- KLA Corporation · 42 open roles · median 139 d
- Micron Technology · 41 open roles · median 43 d
- Intel Corporation · 21 open roles · median 34 d
- Renesas Electronics · 19 open roles · median 44 d
- GlobalFoundries · 14 open roles · median 71 d
- Lumilens · 13 open roles · median 82 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.