Dir Solution Marketing - United States

About the role

This role involves serving as the technical liaison between customers, ecosystem partners, engineering, product management, and business development to facilitate the adoption of Rambus memory interface chip solutions. The focus is on memory subsystems, semiconductor products, and ecosystem enablement, particularly for emerging technologies like DDR6 and MRDIMM.

What you'll do

• Develop, publish, and maintain Product Requirements Documents (PRDs) for memory interface chip products.
• Author and publish technical product collateral including product briefs, datasheets, application notes, white papers, and presentations.
• Serve as the primary technical interface to processor vendors and SoC enablers, building technical relationships across the ecosystem.
• Lead technical preparation and content development for quarterly technical reviews and strategic customer engagements.
• Act as liaison to Rambus JEDEC representatives to ensure standards developments are reflected in product planning.
• Develop and deliver technical education and training programs for customers, partners, and sales teams on technologies like DDR6 and MRDIMM.

What you'll need

• Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical discipline.
• Minimum of 12 years of experience in the semiconductor industry with focus on memory subsystems, server architecture, memory interface chips, DRAM technologies, or memory modules.
• Strong understanding of DDR5, DDR6, RDIMM, MRDIMM, memory power delivery architectures, memory interface chips, and server memory ecosystem requirements.
• Demonstrated experience working with processor vendors, SoC companies, DRAM suppliers, module manufacturers, hyperscalers, OEMs, and ODMs.
• Experience developing technical requirements, product collateral, technical documentation, training materials, and customer-facing technical communications.
• Working knowledge of JEDEC standards processes and the memory industry ecosystem.

Skills: memory interface chips, DDR5, DDR6, MRDIMM, JEDEC standards, product collateral